Experimental Investigations on Heat Transfer Characteristics of Direct Contact Liquid Cooling for CPU

Liu, Cheng; Yu, Hang

doi:10.3390/buildings12070913

Cited by 9 publications

(4 citation statements)

References 41 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Two-phase cooling is a sophisticated cooling technology utilized in GPUs and other high-performance electronic equipment. From the observation made from the survey of selected articles [66][67][68][69], it is evident that two-phase cooling is more efficient than the single-phase cooling technique. To efficiently disperse heat from the GPU, it employs a cooling agent that undergoes a phase transition, often from liquid to vapour.…”

Section: Two-phase Coolingmentioning

confidence: 99%

Active and passive cooling techniques of graphical processing units in automotive applications - a review

Praveen,

2024

Eng. Res. Express

View full text Add to dashboard Cite

Graphical Processing Units (GPU) have become a vital source for data processing in many advanced or smart technologies. They have proven to be faster and more efficient than the Central Processing Unit (CPU) in computing large data sets. The automotive industry has adopted GPUs for Advanced Driver Assistance Systems (ADAS), but other systems like electric vehicles and autonomous vehicles will also employ GPUs soon. Although GPUs are faster at computing large data sets, there is the challenge of a substantial increase in core temperature during the process. This review paper primarily focuses on Active and Passive cooling methods for GPUs in automotive. The paper commences by addressing the role and need for GPUs in the automotive industry and explores the challenges faced by them and the factors that lead to an increase in temperature. The paper further reviews various cooling methods used by Original Equipment Manufacturers (OEM) in the automotive industry. The outcomes of the review are a detailed understanding of the use of GPUs in automotive, a brief interpretation of heating issues in GPUs and what causes them, a comprehensive understanding of the cooling methods used to reduce the core temperature, and a perception of an anticipated technology to resolve the heating problem.

show abstract

Section: Two-phase Coolingmentioning

confidence: 99%

Active and passive cooling techniques of graphical processing units in automotive applications - a review

Praveen,

2024

Eng. Res. Express

View full text Add to dashboard Cite

show abstract

“…A rack-based cooling distribution unit has a cooling capacity between 80 and 200 kW per rack [24]. In contrast, air-based systems can dissipate up to 37 W/cm 2 [25,26]. In the case of TLC, the servers immerse completely in a dielectric fluid in a customized cabinet [20].…”

Section: Data Center Cooling Technologymentioning

confidence: 99%

Analysis of Cooling Technologies in the Data Center Sector on the Basis of Patent Applications

Ott,

Wenzel,

Radgen

2024

Preprint

View full text Add to dashboard Cite

The cooling of server components has been continuously developed over the past few years in order to meet the increasing cooling requirements of server component manufacturers such as for the processor chips. The growth in performance and power density increases the cooling demand. These requirements directly influence the energy consumption and performance of the hardware. To gain a better understanding of the historical evolution and possible future technology development paths in the field of data center cooling, a patent analysis method was used. The focus is on previous and current development priorities and possible research gaps within the server and computer room levels. The European patent database was selected as data source. To determine relevant patents, the search terms for various cooling technologies were developed iteratively. After the patent extraction for the period 2000 - 2023 (earliest priority year), the search results were classified and analysed. Most of the patents deal with air or liquid cooling. In the area of liquid cooling, the focus was on direct liquid cooling, followed by total liquid cooling. Since 2015 a technological shift from air to liquid cooling can be identified on the level of patent activities. In this context, the patent groups with focus on “constructional details for different types of electric apparatus” and “electrical digital data processing” have the largest share of patents. In addition, the technology focus of the TOP 10 patent applicants was in the field of liquid cooling. In conclusion from the patent analysis, it can be derived that liquid cooling will continue to gain in importance in the future and could also be combined with other approaches in the form of hybrid cooling. However air cooling may still be relevant, even if the main cooling load is handled by liquid-based approaches. At the same time, the optimisation potential for air cooling seems to have been largely exploited in comparison to liquid cooling, as can be seen from the falling number of the patent applications.

show abstract

“…Heat sinks and vaper chambers are commonly used in laptops and smartphones to manage and distribute heat from CPUs. According to the way to conduct heat, the active heat dissipation methods are divided into air cooling and liquid cooling [1][2][3]. Liquid cooling involves the use of a liquid coolant, such as water or a specialized fluid, to remove heat from electronic components.…”

Section: Introductionmentioning

confidence: 99%

“…Two-phase liquid cooling involves the use of a coolant fluid that undergoes a phase change from liquid to vapor to absorb heat from electronic components. The vapor then condenses back into liquid form in a separate heat exchanger, releasing the absorbed heat [2]. The addition of nanoparticles to the base fluid could alter its thermophysical properties, such as thermal conductivity, viscosity, and specific heat capacity.…”

Section: Introductionmentioning

confidence: 99%

Improvement in Laptop Heat Dissipation with Taguchi Method

Chang,

Chu,

Lin

2024

Electronics

View full text Add to dashboard Cite

This paper aims to investigate the feasibility of using system power consumption as a factor to improve laptop heat dissipation. The problems due to the CPU overheating are addressed. Based on the Taguchi method, the laptop fan parameters can be optimized with firmware adjustments only. In the Taguchi analysis, the fan speed, system power, and debounce time are considered as control factors, while the Cinebench point is utilized to evaluate the CPU performance. Experimental results demonstrate that the proposed heat dissipation scheme effectively reduces the idle time of a laptop fan. The improvement in heat dissipation can reduce CPU performance degradation because of overheating. According to the best combination of control factors, there is approximately a 5% increase in CPU performance despite a 0.35% increment in power consumption. This paper highlights the effectiveness of optimizing laptop fan parameters through firmware adjustments to improve heat dissipation and mitigate CPU overheating issues. Moreover, the study highlights the delicate balance between power consumption and performance gains. While there may be a slight increase in power consumption associated with the optimized heat dissipation scheme, the observed improvements in CPU performance outweigh this incremental power usage.

show abstract

Experimental Investigations on Heat Transfer Characteristics of Direct Contact Liquid Cooling for CPU

Cited by 9 publications

References 41 publications

Active and passive cooling techniques of graphical processing units in automotive applications - a review

Active and passive cooling techniques of graphical processing units in automotive applications - a review

Analysis of Cooling Technologies in the Data Center Sector on the Basis of Patent Applications

Improvement in Laptop Heat Dissipation with Taguchi Method

Contact Info

Product

Resources

About