2019
DOI: 10.1016/j.ceramint.2019.05.307
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Experimental investigations on surface grinding of silicon nitride subjected to mono and hybrid nanofluids

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Cited by 33 publications
(6 citation statements)
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“…When the mix ratio of MoS 2 and CNT is 2:1, the R a was reduced to 0.294 μm, 13% and 38.9% lower than that of mono MoS 2 and CNT, respectively. Compared with mono MoS 2 in NMQL grinding, subsurface damage layer of Si 3 N 4 was significantly reduced with employment of MoS 2 /WS 2 [129].…”
Section: Machined Surface Qualitymentioning
confidence: 94%
“…When the mix ratio of MoS 2 and CNT is 2:1, the R a was reduced to 0.294 μm, 13% and 38.9% lower than that of mono MoS 2 and CNT, respectively. Compared with mono MoS 2 in NMQL grinding, subsurface damage layer of Si 3 N 4 was significantly reduced with employment of MoS 2 /WS 2 [129].…”
Section: Machined Surface Qualitymentioning
confidence: 94%
“…Zhang et al [73] The result shows the lowest grinding force ratio (0.274) and surface roughness (0.328 mm) obtained using 8 wt.% concentration of nanofluid. Kumar et al [76] have investigated the grinding performance of silicon nitride using mono and hybrid nanofluids at different concentrations and grinding environments. The reduction of grinding forces, specific grinding energy, grinding force ratio, surface roughness obtain using MoS 2 -WS2 hybrid nanofluid, mixing ratio of 1:1.…”
Section: Hybrid Nano Fluid Mql Techniquementioning
confidence: 99%
“…In this study, the rotation status of three contact points one at the interface of the workpiece/upper magnetorheological finishing pad (point A) and other two at the interface of the workpiece/upper magnetorheological finishing pad (point B and point C) was modelled. The kinematics of the ceramic ball was investigated by analyzing the rotating speed ωz and ωj, which were the orthogonal components of and the rotating angle θ and γ (Figure 6c When polishing Si 3 N 4 ceramic balls, the abrasive grains could cause the crack genrations with the depth up to 15 µm at larger finishing parameters, resulting in the excessive fracture on the machined surface [24]. This means that those defects could be observed on surfaces polished with inappropriate selection of parameters.…”
Section: Modelling Of Cmrf Processmentioning
confidence: 99%
“…The material removal mechanism of ceramic materials in abrasive processes, in general, was fracture-dominated [23]. When polishing Si N ceramic balls, the abrasive grains could cause the crack genrations with the depth up to 15 μm at larger finishing parameters, resulting in the excessive fracture on the machined surface [24]. This means that those defects could be observed on surfaces polished with inappropriate selection of parameters.…”
mentioning
confidence: 99%