Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics

Wits, Wessel W.

doi:10.1109/therminic.2018.8593314

Cited by 9 publications

(5 citation statements)

References 27 publications

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“…AM, colloquially also referred to as 3D printing, has facilitated the fabrication of enhanced structures for singlephase and two-phase flows for heat exchange applications. The utilization of AM to enhance heat transfer properties has been demonstrated before at Therminic by the author team [16][17][18] and as e.g. reviewed in [15] selective laser melting is extensively used in the heat transfer and energy conversion fields.…”

Section: B Research Goal and Approachmentioning

confidence: 99%

Utilizing Additive Manufacturing to Enhance Two-Phase Heat Transfer Devices

Winkelhorst

Jafari

Wits

2021

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Two-phase heat transfer devices are among the most popular devices in thermal management systems due to their superior thermal characteristics. This paper investigates a thermosyphon for electronics cooling applications into which a freeform wick structure is inserted to enhance thermal performance. Additive manufacturing is employed to fabricate the wick structure tailored to the thermosyphon at hand using a conductive thermoplastic material. The goal of this study is to investigate how the freeform wick structure inserted into a thermosyphon affects the local liquid and vapor distributions and thus improving the thermal performance. Experiments were carried out with various heat loads and inclination angles, while the temperature distribution was recorded along the length of the thermosyphon. Thermal resistances were determined for both a conventional thermosyphon and an adapted version with an inserted wick structure in order to quantify the enhancement. The obtained experimental data demonstrate that the additively manufactured wick structure gives benefits at higher heat loads due to enhanced evaporation and boiling modes. The evaporation thermal resistance improves by 7% to 13% at heat loads above 55 W for the vertical orientation. Likewise, an improvement of about 7% to 9% was found at a heat load of 105 W for inclination angles of 30° and 60°. Both results exemplify the advantages additive manufacturing may bring to thermal management systems and in particular to two-phase heat transfer devices.

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Section: B Research Goal and Approachmentioning

confidence: 99%

Utilizing Additive Manufacturing to Enhance Two-Phase Heat Transfer Devices

Winkelhorst

Jafari

Wits

2021

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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“…Heat pipes find extensive use in electronics cooling and other high-end applications due to their excellent efficiency and versatile design capabilities [1][2][3]. Heat pipes are devices that transfer heat passively.…”

Section: Introductionmentioning

confidence: 99%

To bend or not to bend: Impact on heat pipe performance

Wits,

Groot,

Jafari

2023

2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Thermal management of electronics continues to be a dominant factor that needs attention already early in the design phase. Within complex systems, typically a battle for space is imminent due to the multidisciplinary nature. In this respect, the use of low-form-factor phase-transitional devices is standard industry practice nowadays. In particular, heat pipes have demonstrated high heat transfer rates, due to the utilization of a working fluid's latent heat in combination with reliable, small and lightweight designs. Heat pipes are employed in electronics cooling in which they are often bent and operated under different operating conditions. This study aims to investigate how heat pipes function when bent at various angles and inclinations. The impact of various bending angles (no bend, 30° bend, 2 30° bend, 45° bend, 2 45° bend and 90° bend) and x x inclination angles (horizontal, ±45° and ±90°) is examined. Bending losses and an associated theoretical model are validated for sintered-wick heat pipes. Heat pipe bending has minimal effect on the thermal performance as long as the bending angle does not exceed 45°. It is however important to consider gravity when operating bent heat pipes outside the horizontal plane.

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“…Consequently, improved methodologies for high-performance, reliable and lightweight cooling devices are required. Many researchers and industry solutions have proposed Heat Pipes (HPs) as a solution to this challenging subject, given the fact that their phase-change properties result in high heat transfer rates [2][3]. With increasing heat flux levels, non-uniform heat distribution and (local) overheating, conventional HPs cannot address this requirement.…”

Section: Introductionmentioning

confidence: 99%

Improving the performance of flat heat pipes by exploiting benefits of additive manufacturing

Jafari

Wits

2022

2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Next to the industrial pick-up of Flat Heat Pipe (FHP) technology, the overall understanding of its two-phase heat transfer characteristics will contribute to further improvements of its performance. In this study, an FHP with dimensions of 20×40×6 mm 3 was designed and manufactured. Investigations until now have concentrated on conventional manufacturing technologies rather than on the performance of FHPs using novel Additive Manufacturing (AM) techniques. Surface-functional wick structures were additively fabricated having the appearance of a screen mesh enriched with sinteredlike microstructures. The effects of heat load (ranging from 7.5 to 82.5 kW/m 2 ), cooling water temperature (ranging from 25°C to 45°C) and inclination angle (horizontal to vertical) on the FHP's heat transfer characteristics were examined experimentally. In this paper, key performance indicators, such as temperature distribution, thermal resistance and superheat, are discussed. Results show that the developed FHP can effectively transfer heat. Moreover, optimal combinations of cooling water temperature and inclination angle were found defined by the lowest superheat and thermal resistance. A minimum total thermal resistance of 0.30 K/W for a heat load of 67.5 kW/m 2 was reached for the following conditions: (a) 30° inclination angle and 25°C cooling water temperature, or (b) horizontal orientation and 35°C cooling water temperature. Moreover, as the cooling water temperature decreases from 45°C to 25℃, the condenser wall temperature decreases; however, thermal resistances do not decrease continuously as well. Also, tilting the FHP at relatively high heat loads does not impact the thermal performance. The FHP proposed in this study profits from novel AM fabrication capabilities and could suit thermal management challenges of current and future electronic components due to its excellent heat transfer characteristics, consistent temperature distribution and manufacturing flexibility.

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Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics

Cited by 9 publications

References 27 publications

Utilizing Additive Manufacturing to Enhance Two-Phase Heat Transfer Devices

Utilizing Additive Manufacturing to Enhance Two-Phase Heat Transfer Devices

To bend or not to bend: Impact on heat pipe performance

Improving the performance of flat heat pipes by exploiting benefits of additive manufacturing

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