Experimental study of a novel loop heat pipe with a vapor-driven jet injector

Liu, Lei; Yang, Xiaoping; Yuan, Bo; Wei, Jinjia

doi:10.1016/j.ijheatmasstransfer.2020.120518

Cited by 18 publications

(1 citation statement)

References 40 publications

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“…It offers several advantages, including high heat transfer capability, long heat transport distance, flexible transport lines, antigravity heat transfer, and the absence of moving parts. These characteristics make LHPs ideal heat dissipation devices for various applications such as microelectronics, new energy vehicles, and aerospace. − In Figure a, a schematic of an LHP is depicted. When a heat load is applied to the evaporator, the liquid within the wick undergoes vaporization, resulting in the formation of evaporating menisci at the liquid–vapor interface.…”

Section: Introductionmentioning

confidence: 99%

Superior Heat and Mass Transfer Performance of Bionic Wick with Finger-like Pores Inspired by the Stomatal Array of Natural Leaf

Xu,

Long,

Chen

et al. 2024

Langmuir

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The thermal management of electronics has gained significant attention, with loop heat pipes (LHPs) emerging as an attractive solution for heat dissipation. The heat transfer performance of LHPs is influenced by the heat and mass transfer processes within the wick. However, designing the pore diameter of the wick is challenging due to the different requirements of flow resistance and capillary force. Specifically, the working fluid needs large pores to reduce resistance, while the liquid suction requires small pores to provide a large capillary force. To address this issue, we drew inspiration from the stomatal array of natural leaves used for transpiration and developed an alumina ceramic bionic wick with finger-like pores using the phase-inversion tape casting method. The finger-like pores in the wick resemble the straight hole structure of stomata, which increases the gas−liquid interface area within the wick. This design allows for timely discharge of water vapor generated by boiling, thereby reducing mass transfer resistance. Additionally, numerous micrometer-sized small pores surrounding the finger-like pores provide sufficient capillary force to replenish liquid for the gas−liquid evaporation interface. Experimental results demonstrate that the introduction of finger-like pores in the wick increases gas and water permeabilities by 2.4 and 5.2 times, respectively. Furthermore, the superior heat and mass transfer performance of the bionic wick was demonstrated with an LHP. This work effectively addresses the conflicting demands of capillary force and flow resistance, enhancing the heat transfer performance of LHPs, which holds great promise for addressing heat dissipation challenges in high power density electronic chips and has potential applications in aviation, aerospace, and microelectronics for efficient thermal management.

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