2012
DOI: 10.1016/j.matdes.2012.01.026
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Experimental study of diffusion welding/bonding of titanium to copper

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Cited by 125 publications
(36 citation statements)
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“…However, fusion welding and brazing welding are not suitable for joining Ti to Cu because brittle Ti-Cu intermetallic compounds (IMCs) are easily formed [3][4][5], which can seriously cause the mechanical properties of the Ti/Cu joint to deteriorate. Therefore, several kinds of welding techniques, such as explosive welding [6], friction welding [7], diffusion welding [8], and vaporizing foil actuator welding [9] were presented as methods for joining Ti to Cu plates. In recent years, with the rapid development of microelectronics and medical industries, joining of thin Ti foil to Cu foil may have a wide application prospect.…”
Section: Introductionmentioning
confidence: 99%
“…However, fusion welding and brazing welding are not suitable for joining Ti to Cu because brittle Ti-Cu intermetallic compounds (IMCs) are easily formed [3][4][5], which can seriously cause the mechanical properties of the Ti/Cu joint to deteriorate. Therefore, several kinds of welding techniques, such as explosive welding [6], friction welding [7], diffusion welding [8], and vaporizing foil actuator welding [9] were presented as methods for joining Ti to Cu plates. In recent years, with the rapid development of microelectronics and medical industries, joining of thin Ti foil to Cu foil may have a wide application prospect.…”
Section: Introductionmentioning
confidence: 99%
“…Both grinding and polishing processes were done with Struers LaboPol-5 at a velocity of 500 rev/min. The samples were etched with a chemical solution: 1% HF-1.5% HCl-2.5% HNO 3 -95% H 2 O [14].…”
Section: Methodsmentioning
confidence: 99%
“…Both grinding and polishing processes were done with Struers LaboPol-5 at a velocity of 500 rev/min. The samples were etched with a chemical solution: 1% HF-1.5% HCl-2.5% HNO3-95% H2O [14]. Microstructure and morphologies of diffusion interfaces were examined by scanning electron microscopy (SEM, Philips XL30S FEG, Tustin, CA, USA).…”
Section: Methodsmentioning
confidence: 99%
“…Both grinding and polishing processes were done with Struers LaboPol-5 at angular velocity of 500 rev min −1 . Samples were etched with a chemical solution; 1% HF -1.5% HCL -2.5% HNO3 -95% H2O (Aydın et al, 2012). At the end, Metallographic examinations were done to the bonded samples.…”
Section: Methodsmentioning
confidence: 99%