Experimental study of subcooled boiling pool heat transfer and its “hook back” phenomenon on micro/nanostructured surfaces

Liu, Bin; Liu, Jie; Zhou, Jie; Yuan, Bo; Zhang, Yonghai; Wei, Jinjia; Wang, Wenjun

doi:10.1016/j.icheatmasstransfer.2018.12.018

Cited by 42 publications

(8 citation statements)

References 29 publications

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“…Liu et al 30 studied pool‐boiling heat transfer for N ‐pentane around a microstructured or nanostructured surface and observed that the heat transfer coefficient of all micro/nanostructured surfaces increased with the decrease of CHF. Again Liu et al 31 experimentally investigated the pool‐boiling heat transfer of dissolved FC‐72 gas on a structured surface by using the Hook‐Back phenomenon. The results revealed that enhancement of CHF around microstructured or nanostructured surface occurred with the increase in subcooling.…”

Section: Experimental Studiesmentioning

confidence: 99%

Improvement of heat transfer through fins: A brief review of recent developments

Maji¹,

Choubey

2020

Heat Trans

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Fins or extended surfaces are generally used in heat exchangers to enhance heat transfer between the main surface and ambient fluid. Various types of simple-shaped fins, namely, rectangular, square, annular, cylindrical, and tapered, have been used with different geometrical combinations. To satisfy industrial demand, different trials have also been carried out for designing optimized fins. The optimization of fins can be performed either by enhancing heat dissipation at an exact fin weight or by diminishing the weight of the fin by precise heat dissipation. Recently a notable amount of work on some typical fins, like, porous fins and perforated fins, has also been carried out. This paper presents a brief review on heat transfer enhancement using fins of different types considering variable thermophysical and geometric parameters, which will also be useful for future use of geometrical modifications of extended surfaces, based on the cost and availability of space.analytical approach, computational approach, experimental approach, perforated fin, porous fin | INTRODUCTIONAdvanced technologies need high-performance heat transfer equipment. Techniques for enhancing the heat transfer rate are classified into two categories: active and passive methods. In the design point of view, active methods are complex as they require some extraneous power input for necessary flow adjustments and to improve the heat transfer rate and thus applications are limited. On the other hand, passive methods require geometrical or surface adjustments to the flow passage by incorporating additional devices. Additionally, by interrupting or varying the existing flow behavior (except for extended surfaces); higher heat transfer coefficients are promoted through this method, which is also followed by an increase in the corresponding pressure drop. The amount of conduction, convection, and radiation of an object shows the amount of heat it transfers. The heat transfer rate is enhanced by increasing the temperature difference between the object and the environment or by enhancing the coefficient of convective heat transfer or by maximizing the surface area of the body. In some cases, it is not appropriate or cost effective to alter the first two options. Introducing a fin to a body, however, expands the surface area and sometimes this is a cost-effective solution for heat transfer problems. Extended surfaces or fins are illustrations of passive methods that are generally used in different industrial applications for the enhancement of heat transfer between the primary surface (heat sink) and the surrounding fluid. Currently reducing the cost and size of fins is the key target of the fin industry. This demand is generally met by the high-thermal-conductivity and costly metals used to fabricate finned surfaces. Many efforts have been made to construct optimized fins. (a) By changing the size and shape of the solid fin: Instead of a longitudinal rectangular solid fin, if the geometry of fin design is changed, the performance parameters and heat tr...

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Section: Experimental Studiesmentioning

confidence: 99%

Improvement of heat transfer through fins: A brief review of recent developments

Maji¹,

Choubey

2020

Heat Trans

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“…In addition, a wet/dry etching technique was used to fabricate micro pin fins, 40 − 44 micro cavities, 45 and nanowires, 46 − 48 while a new emerging laser technique was also attempted to modify the boiling surfaces, obtaining micro pin fins 49 − 51 and micro cavities. 52 Pool boiling of various liquids was experimentally investigated on the surfaces mentioned above, including SES36, 37 HFE-7200, 38 , 39 FC-72, 41 , 43 , 49 , 50 n-pentane, 51 and water, and on other surfaces. It was found that the boiling performance was considerably enhanced, but micro/nanocomposite structures generally were more favorable than sole micro- or nanostructures concerning the heat transfer coefficient or the critical heat flux.…”

Section: Introductionmentioning

confidence: 99%

“…Other coating technologies involve atomic layer deposition, − oxidation, , chemical vapor deposition, ,− electrophoretic deposition, − etc. In addition, a wet/dry etching technique was used to fabricate micro pin fins, − micro cavities, and nanowires, − while a new emerging laser technique was also attempted to modify the boiling surfaces, obtaining micro pin fins − and micro cavities . Pool boiling of various liquids was experimentally investigated on the surfaces mentioned above, including SES36, HFE-7200, , FC-72, ,,, n-pentane, and water, and on other surfaces.…”

Section: Introductionmentioning

confidence: 99%

Nanoparticle-Assisted Pool Boiling Heat Transfer on Micro-Pin-Fin Surfaces

et al. 2021

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Boiling heat transfer intensification is of significant relevance to energy conversion and various cooling processes. This study aimed to enhance the saturated pool boiling of FC-72 (a dielectric liquid) by surface modifications and explore mechanisms of the enhancement. Specifically, circular and square micro pin fins were fabricated on silicon surfaces by dry etching and then copper nanoparticles were deposited on the micro-pin-fin surfaces by electrostatic deposition. Experimental results indicated that compared with a smooth surface, the micro pin fins increased the heat transfer coefficient and the critical heat flux by more than 200 and 65–83%, respectively, which were further enhanced by the nanoparticles up to 24% and more than 20%, respectively. Correspondingly, the enhancement mechanism was carefully explored by high-speed bubble visualizations, surface wickability measurements, and model analysis. It was quantitatively found that small bubble departure diameters with high bubble departure frequencies promoted high heat transfer coefficients. The wickability, which characterizes the ability of a liquid to rewet a surface, played an important role in determining the critical heat flux, but further analyses indicated that evaporation beneath bubbles was also essential and competition between the wicking and the evaporation finally triggered the critical heat flux.

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“…Fluorocarbon and Novec fluids are highly wetting fluids which result in an obvious higher boiling incipient superheat and a high tendency for leakage [47][48][49]. Other researchers also reported the same trend when FC-72 was applied as the working fluid [59][60][61][62][63]. Rainey [59] explained the insensitivity of NBHT coefficient on subcooling by the combined effects of increased natural convection and Marongoni convection, and decreased microconvection and latent heat, as the subcooling degree was increased.…”

Section: Pool Boilingmentioning

confidence: 83%

“…Cao et al [64] also observed an increase function of NBHT coefficient with subcooling on nanoparticle-deposited pin-fin surfaces. Liu et al [61] investigated micro/nanostructured surfaces processed by femtosecond laser with different processing spacings in pool boiling. Different trends were found on the surfaces with different geometry parameters.…”

Section: Pool Boilingmentioning

confidence: 99%

Submerged boiling and jet impingement for cooling high power electronics

Fan¹

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Experimental study of subcooled boiling pool heat transfer and its “hook back” phenomenon on micro/nanostructured surfaces

Cited by 42 publications

References 29 publications

Improvement of heat transfer through fins: A brief review of recent developments

Improvement of heat transfer through fins: A brief review of recent developments

Nanoparticle-Assisted Pool Boiling Heat Transfer on Micro-Pin-Fin Surfaces

Submerged boiling and jet impingement for cooling high power electronics

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