Experimental Study of the Packaging Failure for Optical Fiber Arrays

Abstract

Optical fiber array is a key component in the assembly of planar optical waveguide devices and enable greater channel counts than previously. However, assembling optical fiber array has been a challenge due to the stringent performance and reliability requirements posed by optical fiber communication applications. This paper investigates the causes of the failures involving the adhesive including: surface contamination, air entrapment, uneven curing, curing shrinkage; and thermal expansion coefficient mismatch.