Abstract:Mass via arrays (MVAs) are intersubstrate thermal management structures that utilize thermal meta-material design principles to target localized hot spots and extreme variation in the temperature profile of electronic systems. MVAs have shown promise for integration into electronic systems as passive thermal management techniques. Theoretical analysis has shown that, when properly designed, MVAs and MVA-like structures provide control over how the heat is transferred in an electronic substrate. While the theor… Show more
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