Experimental Study of Transient Dose Rate Effect on System-in-Package SZ0501

Li, Yang; Li, Junlin; Guo, Yaxin; He, Chaohui; Li, Ruibin; Chen, Wei; Liao, Wenlong; Li, Pei; Liu, Jiaxin; Peng, Zhigang

doi:10.1109/tns.2022.3189957

Search citation statements

Order By: Relevance

Paper Sections

Select...

Sip的辐射效应研究现状1

Sip Reliability Analysis and Testing1

Citation Types

Supporting

Mentioning

Contrasting

Unclassified

Year Published

2023

2024

Publication Types

Select...

Article6

Relationship

Self Cite1

Independent5

Authors

Journals

Cited by 6 publications

(2 citation statements)

References 26 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…. 目前, 国内外仅查到少量关于 SiP单粒子瞬态脉冲 [111] 、总剂量效应 [13,15,16] 、瞬时剂量率效应 [112] 和电磁脉冲效应 [113] 的论文, 还未见更多关于SiP辐射效应的论文.…”

Section: Sip的辐射效应研究现状unclassified

Radiation effects and radiation hardening technology of new microsystems

HE,

CHEN,

HAN

et al. 2024

Sci. Sin.-Phys. Mech. Astron.

Self Cite

View full text Add to dashboard Cite

Section: Sip的辐射效应研究现状unclassified

Radiation effects and radiation hardening technology of new microsystems

HE,

CHEN,

HAN

et al. 2024

Sci. Sin.-Phys. Mech. Astron.

Self Cite

View full text Add to dashboard Cite

“…The JTAG can be tested directly through the SoC in the multiplexed system for the testing of SiP devices. The transient dose rate effect (TDRE) of the SiP [ 83 ], which results in the combination of electrons and holes, producing photocurrents, which subsequently interfere with the circuit, is treated similarly. The response method involves programming and recording the characteristics and locations of abnormal signals in the circuit using a field-programmable gate array (FPGA), which is already built into the SiP.…”

Section: Sip Reliability Analysis and Testingmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

View full text Add to dashboard Cite

The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

show abstract

Analysis of the transient dose rate effect on clock resources of JXCV5SX95T FPGA

Guo,

Peng,

et al. 2023

Microelectronics Reliability

View full text Add to dashboard Cite

Experimental Study of Transient Dose Rate Effect on System-in-Package SZ0501

Cited by 6 publications

References 26 publications

Radiation effects and radiation hardening technology of new microsystems

Radiation effects and radiation hardening technology of new microsystems

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Analysis of the transient dose rate effect on clock resources of JXCV5SX95T FPGA

Contact Info

Product

Resources

About