Experimental Study on Temperature during Wire Saw Slicing

Abstract

Heat generated during wire saw slicing can cause silicon temperature raise and make silicon wafer warpage, especially for larger silicon wafers. In order to study the wire saw effect on silicon temperature during slicing process, three kinds of wire saw, mainly semi-fixed abrasive wire saw and traditional wire saw, are applied for slicing silicon ingot. In this paper, the thermocouple is used to measure the temperature of the silicon during wire saw slicing. The experiment results show that the temperature of the silicon increases along with the wire saw working direction and reaches maximum value near the outlet position of silicon. The temperature of the silicon sliced by semi-fixed abrasive wire saw is lower than that sliced by traditional wire saw.

Surface Quality Improvement for Ultrasonic-Assisted Inner Diameter Sawing with Six-Axis Force Sensors

“…The number of active abrasive particles on the cutting edge of the inner diameter blade was calculated according to the diamond abrasive particle size, abrasive particle concentration, and blade size. In our model, the abrasive particles were simplified as rigid spheres, so the volume of a single abrasive particle was 4 3 πr 3 m . The abrasive particles were considered evenly distributed on the inner diameter sawing blade based on the previous assumption, and the number of abrasive particles on the inner edge of the inner diameter sawing blade could be determined with the following formula:…”

“…There are two main processing methods for hard and brittle material slicing: diameter sawing [ 1 , 2 , 3 ] and wire sawing [ 4 , 5 , 6 , 7 ]. The diameter sawing methods broadly include inner diameter sawing [ 8 , 9 , 10 ] and external diameter sawing [ 11 , 12 ].…”

An Improved Normal Sawing Force Model with Spherical Abrasive Particles for Ultrasonic Assisted Inner Diameter Sawing

“…Under normal circumstances, there are two main processing methods for ceramics slicing: diameter sawing technology [6][7][8] and wire sawing technology [9][10][11][12]. The diameter sawing technology is divided into inner diameter sawing technology [13][14][15] and external diameter sawing technology [16,17].…”