Fire safety and thermal dissipation performance of epoxy resins thermosets were critical for its application in key fields such as electronic devices. The simultaneous improvement of flame retardant and thermal conductivity properties were still a challenge. Herein, ammonium polyphosphate (APP) was firstly encapsulated with 5-wt% epoxy resins based on APP and then surface grafted with polyurethane polymer chain, and the resulting APP with core-shell-brush structure was constructed. Finally, the multiwalled carbon nanotube (MWCNT) was assembled in the intervals of polymer brush on APP surface, and the prepared filler was defined as MF-APP. Its chemical structure and morphologies were characterized and confirmed. The wettability of MF-APP was evaluated by water contact angles tests (WCA) and MF-APP exhibited hydrophobic property with the WCA of 138°. When 9-wt% MF-APP was incorporated into EP thermosets, the thermal conductive value of EP/MF-APP achieved 1.02 Wm −1 K −1 , and the MWCNTs concentration was only 1.8 wt% in thermosets.Compared with the previous work, the prepared EP/MF-APP thermosets exhibited outstanding thermal conductive efficiency because of the homogeneously distribution of MWCNTs. Moreover, the samples fulfilled UL-94 V-0 grade during vertical burning tests with the limiting oxygen index of 30.8%. As a result, the thermal conductivity and flame retardancy of EP thermosets were simultaneously enhanced with a relatively low addition amount of MF-APP, which would bring more chance for wider application of EP thermosets in key fields. KEYWORDS core-shell-brush structure, epoxy resin, flame retardancy, thermal conductivity 1 | INTRODUCTION Epoxy resin (EP) has been widely used in electronic and electrical industries, especially in printed circuit board (PCB) because of its exciting properties such as corrosion resistance, electrical insulation, and high strength. 1-3 With the development of electronic devices toward miniaturization and integration, a large number of heat fluxes in electronic equipment are generated during operation process. It is crucial for the devices that the produced heat can be effectively dissipated. However, EP thermosets exhibit low intrinsic thermal conductivity of 0.1 to 0.4 Wm −1 K −1 . 4-6 Besides, the fire risk is a significant drawback of the EP thermosets. Considering the public safety and the requirement of electronic devices, the simultaneous improvement of thermal conductivity and flame retardancy for the EPs thermosets is becoming an urgent problem and has attracted a lot of attention over the years.To enhance the thermal conductivity, the traditional highly thermally conductive fillers (~5000 Wm −1 K −1 ) such as aluminum oxide, 7,8 whiskers, 9 nanosilica, 10 and aluminum nitride 11 are generally incorporated into the polymeric material. However, the high loading amount (about 30%-60% by volume) is required to fulfill the thermal conductivity (>1 Wm −1 K −1 ). Besides, the high addition amount of filler would deteriorate the processing and the mechanical properties...