Experimentally validated finite element analysis for evaluating subsurface damage depth in glass grinding using Johnson-Holmquist model

Pashmforoush, Farzad; Esmaeilzare, Amir

doi:10.1007/s12541-017-0213-2

Cited by 16 publications

(4 citation statements)

References 16 publications

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“…Determining the main shear zone flow stress silicon carbide J-H constitutive model ref. 27. Given the actual processing conditions, subjected to high strain, high strain rate, and heavy pressure, the Johnson-Holmquist (JH-2) model is suitable for simulating the mechanical properties of brittle materials, and has certain compliance with experimental materials.…”

Section: Cutting Force Modelmentioning

confidence: 99%

An analytical cutting force model of quasi-intermittent vibration assisted swing cutting based on predictive machining theory

Guo

Zhou

et al. 2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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Quasi-intermittent vibration assisted swing (QVASC) method was aimed to improve the cutting machinability of difficult-to-machine materials. Inherited the intermittent cutting characteristics of the elliptical vibration cutting (EVC) technology, this method reduces the impact of residual height on the machined surface quality. But there is still a lack of in-depth research on cutting force modeling of QVASC. Based on the conventional cutting force model, a cutting force prediction model in QVASC processing, which considers the time-variable characteristics of QVASC, adopts the non-equidistant shear zone model and regards the workpiece material properties, tool geometry, and cutting conditions as the input data are proposed in this paper. Using the micro-element method, the proposed model decomposed the cutting edge to calculate the cutting force and the cutting force value by superimposing them. It finally predicts the chip flow angle. Experimental results show that when the cutting velocity increases, the average cutting force and the Z -direction increases by 20%, the average cutting force and the Y direction decreases by 17%. The average cutting force along X direction remains unchanged; the depth of cutting became larger. Besides, the average cutting force X decreased by 18%, Y decreased 21%, and Z increased by 13%. As the feed rate increases, the X direction is increased by 26%, and the Z direction is reduced by 22%, while the cutting force in the Y direction is unchanged. After comparing and verifying the measured value and the predicted value, the minimum error of the prediction model reaches 4.01%, which validates the force model of QVACS.

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Section: Cutting Force Modelmentioning

confidence: 99%

An analytical cutting force model of quasi-intermittent vibration assisted swing cutting based on predictive machining theory

Guo

Zhou

et al. 2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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show abstract

“…Based on the theory of indentation fracture mechanics, this method proposed an SSD prediction model that comprehensively considered both median and lateral cracks below the abrasive during wire saw cutting, and theoretically predicted the SSD of silicon wafers. In addition to using mathematical modeling methods, the finite element analysis modeling method has also been applied to the analysis of SSD in machining such as grinding [10] and diamond wire saw cutting [3,11,12]. The SSD was analyzed following the application of maximum stress on the wafer, when subsurface cracks occur during slicing processing.…”

Section: Introductionmentioning

confidence: 99%

Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon

Wang,

Gao,

Yang

2024

Materials

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In diamond wire saw cutting monocrystalline silicon (mono-Si), the material brittleness removal can cause microcrack damage in the subsurface of the as-sawn silicon wafer, which has a significant impact on the mechanical properties and subsequent processing steps of the wafers. In order to quickly and non-destructively obtain the subsurface microcrack damage depth (SSD) of as-sawn silicon wafers, this paper conducted research on the SSD prediction model for diamond wire saw cutting of mono-Si, and established the relationship between the SSD and the as-sawn surface roughness value (SR) by comprehensively considering the effect of tangential force and the influence of the elastic stress field and residual stress field below the abrasive on the propagation of median cracks. Furthermore, the theoretical relationship model between SR and SSD has been improved by adding a coefficient considering the influence of material ductile regime removal on SR values based on experiments sawing mono-Si along the (111) crystal plane, making the theoretical prediction value of SSD more accurate. The research results indicate that a decrease in wire speed and an increase in feed speed result in an increase in SR and SSD in silicon wafers. There is a non-linear increasing relationship between silicon wafer SSD and SR, with SSD = 21.179 Ra4/3. The larger the SR, the deeper the SSD, and the smaller the relative error of SSD between the theoretical predicted and experimental measurements. The research results provide a theoretical and experimental basis for predicting silicon wafer SSD in diamond wire sawing and optimizing the process.

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“…Li [5] developed a regression model for subsurface crack depth (SSCD) estimation by combining theoretical mechanical analysis and experimental approach, but the scratching tests conducted in this work differed from the practical machining, as the abrasive grains used in the latter are often random in shape and quantity. There are also many useful studies on the prediction of SSCD by using simulations [6] and regression analysis [7]. To develop an analytical approach, Yu [8] used the damage-zone analysis method and verified the accuracy of the proposed model experimentally.…”

Section: Introductionmentioning

confidence: 99%

Crack Forms Sensitivity-Based Prediction on Subsurface Cracks Depth in Ultrasonic-Vibration-Assisted Grinding of Optical Glasses

Zhao¹,

Zhang²,

Liu³

2021

Applied Sciences

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Subsurface cracks in ultrasonic-vibration-assisted grinding (UVAG) of optical glasses often exhibit diverse forms and proportions. Due to the variety of loads involved in crack formation and propagation, the crack forms and propagation depths have different sensitivities to each process parameter. Predicting the maximum subsurface cracks depth (MSSCD) by considering the varying effects of process parameters plays a key role in implementing effective control of the UVAG process. In this work, the subsurface crack forms and their proportions are investigated by conducting 40 sets of UVAG experiments. The varying effects of the grinding and ultrasonic parameters on the crack form proportions are unveiled by using grey relational analysis. The weighted least square support vector machine (WLS-SVM) prediction model for the MSSCD was developed. Twelve sets of UVAG experiments were carried out to validate the proposed model. The results show that arc-shaped cracks and bifurcated cracks account for 72.5% of all cracks, while ultrasonic vibration amplitude influences most of the proportions of arc-shaped and bifurcated cracks. Compared to other widely used prediction methods, the maximum and average relative prediction errors of the proposed model are 10.54% and 5.59%, respectively, which proves the high prediction accuracy of the model.

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Experimentally validated finite element analysis for evaluating subsurface damage depth in glass grinding using Johnson-Holmquist model

Cited by 16 publications

References 16 publications

An analytical cutting force model of quasi-intermittent vibration assisted swing cutting based on predictive machining theory

An analytical cutting force model of quasi-intermittent vibration assisted swing cutting based on predictive machining theory

Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon

Crack Forms Sensitivity-Based Prediction on Subsurface Cracks Depth in Ultrasonic-Vibration-Assisted Grinding of Optical Glasses

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