Experimentally validated finite element model of electrocaloric multilayer ceramic structures

Abstract

A chip scale electrocaloric effect based cooling deviceA novel finite element model to simulate the electrocaloric response of a multilayer ceramic capacitor (MLCC) under real environment and operational conditions has been developed. The two-dimensional transient conductive heat transfer model presented includes the electrocaloric effect as a source term, as well as accounting for radiative and convective effects. The model has been validated with experimental data obtained from the direct imaging of MLCC transient temperature variation under application of an electric field. The good agreement between simulated and experimental data, suggests that the novel experimental direct measurement methodology and the finite element model could be used to support the design of optimised electrocaloric units and operating conditions. [http://dx.

Study of the Physical Properties and Electrocaloric Effect in the BaTiO3 Nano- and Microceramics

“…The other type of ferroelectric materials promising for obtaining high ECE values is multilayer structures [9,10]. They are stable against strong electric fields due to the alternation of thin (~3 μm) layers in their volume; in addition, they have a large thermal mass and, therefore, high cooling power.…”

Исследования физических свойств и электрокалорического эффекта в нано- и микрокерамике BaTiO-=SUB=-3-=/SUB=-

“…Другими перспективными сегнетоэлектрическими материалами с точки зрения реализации значительных величин ЭКЭ являются мультислойные структуры [9,10]. Они оказываются стойкими к электрическим полям высокой напряженности вследствие чередования в их объеме тонких слоев (∼ 3 µm), а также обладают большой тепловой массой и, следовательно, высокой мощностью охлаждения.…”

Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators

“…The EC response of a multilayer ceramic capacitor (MLCC) under real environment and operational conditions, but without thermal connections, was considered in [6]. The two-dimensional transient heat transfer model included the EC effect as a source term and accounted for radiative and convective heat losses at the interfaces.…”