Exploration and Analysis of Through-Glass Vias for High-Speed, Low-Loss Vertical Interconnects in Glass-Based 3-D Integrated Circuits

Fang, Zhen; Zhang, Jihua; Liu, Jinxu; Fu, Juefeng; Li, Shuqi; Cai, Xingzhou; Gao, Libin; Chen, Hongwei; Zhang, Wanli

doi:10.1109/ted.2024.3405407

IEEE Trans. Electron Devices

2024

DOI: 10.1109/ted.2024.3405407

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Exploration and Analysis of Through-Glass Vias for High-Speed, Low-Loss Vertical Interconnects in Glass-Based 3-D Integrated Circuits

Zhen Fang,

Jihua Zhang,

Jinxu Liu

et al.

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Progress in Research on Co-Packaged Optics

Tian,

Hou,

Dang

et al. 2024

Micromachines

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In the 5G era, the demand for high-bandwidth computing, transmission, and storage has led to the development of optoelectronic interconnect technology. This technology has evolved from traditional board-edge optical modules to smaller and more integrated solutions. Co-packaged optics (CPO) has evolved as a solution to meet the growing demand for data. Compared to typical optoelectronic connectivity technology, CPO presents distinct benefits in terms of bandwidth, size, weight, and power consumption. This study presents an overview of CPO, highlighting its fundamental principles, advantages, and distinctive features. Additionally, it examines the current research progress of two distinct approaches utilizing Vertical-Cavity Surface-Emitting Laser (VCSEL) and silicon photonics integration technology. Additionally, it provides a concise overview of the many application situations of CPO. Expanding on this, the analysis focuses on the CPO using 2D, 2.5D, and 3D packaging techniques. Lastly, taking into account the present technological environment, the scientific obstacles encountered by CPO are analyzed, and its future progress is predicted.

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Progress in Research on Co-Packaged Optics

Tian,

Hou,

Dang

et al. 2024

Micromachines

View full text Add to dashboard Cite

show abstract

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Exploration and Analysis of Through-Glass Vias for High-Speed, Low-Loss Vertical Interconnects in Glass-Based 3-D Integrated Circuits

Cited by 1 publication

References 26 publications

Progress in Research on Co-Packaged Optics

Progress in Research on Co-Packaged Optics

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