Exploration of the deposition of submicrometer particles by spin-coating

Abstract

The deposition of Cu, Zn, Pt, and Co precursor particles from solution onto a flat silicon wafer using a spin coater was studied. Homogeneously distributed monodisperse particles can be obtained. The dependence of particle size and number density on solution concentration and rotation frequency was investigated. Different solvents and support modifications were studied. The particles were analyzed using dark-field microscopy, scanning electron microscopy, and atomic force microscopy.

Impact of film drying procedures on RDE characterization of Pt/VC electrocatalysts

“…Spin coating is a widely used process in the microelectronics industry to obtain thin films of polymers or photoresists on flat substrates [15][16][17][18][19][20]. This technique has also been employed successfully for the deposition of particles from solutions yielding monodisperse and homogeneously distributed particles [21][22][23][24]. A typical process involves depositing a small aliquot of ink or solution onto the center of a substrate and then spinning the substrate at high speed (typically around 3000 rpm).…”

“…As the film thins, the solvent evaporates from this film and the solute deposits homogenously on the substrate. By changing factors such as rotation frequency, initial concentration, precursor, solvent, and support, it is possible to control the size, number density and deposition patterns of the deposited particles [24].…”

Nanocluster formation by spin coating: Quantitative atomic force microscopy and Rutherford backscattering spectrometry analysis

“…It has been shown previously that the presence of water in the solvent or in the atmosphere during spin coating can stop the solution from wetting the surface fully as the solvent evaporates. 17 This is particularly problematic in the case of solvents with high evaporation rates, since the rapid evaporation of the solvent leads to local cooling and hence water condensation. The sharply delineated boundaries between those areas showing a high particle density and those with a low particle density lead us to conclude that water condensation and/or surface contamination was probably the cause of this inhomogeneous deposition, as discussed in a separate article.…”

Comparison of Two Preparation Methods in the Redox Properties of Pd/CeO2/Ta/Si Model Catalysts: Spin Coating Versus Sputter Deposition

“…Spin coating, which is a well-known technique for the deposition of polymeric photo resist layers on substrates [8], is suggested to be an effective way to deposit small metal-precursor particles such as Cu, Zn, Pt and Co on flat substrates [9][10][11]. Supported metal catalysts have been prepared by a conventional impregnation method, however, which is not applicable to flat model supports due to the absence of stabilizing capillary forces.…”

“…When the solvent evaporates from this film, the solute deposits homogenously onto the substrate, leading to the narrow particle distribution. By changing spin coating parameters, two important characteristics of model catalysts can be adjusted:the loading and the morphology of the catalyst particles [9][10][11]. Using such a flat model catalyst has advantages on the parallel use of other surface science tools.…”