Explore the impact of improvement that the Polyimide adhesive residue on QFN Package

Liu, Kent-Ting

doi:10.1109/impact.2009.5382276

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference 2009

DOI: 10.1109/impact.2009.5382276

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Explore the impact of improvement that the Polyimide adhesive residue on QFN Package

Kent-Ting Liu

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Explore the impact of improvement that the Polyimide adhesive residue on QFN Package

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