2023 IEEE International Reliability Physics Symposium (IRPS) 2023
DOI: 10.1109/irps48203.2023.10117650
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Extended Analysis of Power Cycling Behavior of TO-Packaged SiC Power MOSFETs

Ivana Kovacevic-Badstuebner
1
,
Salvatore Race
2
,
Ulrike Großner
3
et al.
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Cited by 3 publications
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Fast Liquid-to-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package

Amoroso,
Donetti,
Schifano
et al. 2024
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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Fast Liquid-to-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package

Amoroso,
Donetti,
Schifano
et al. 2024
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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Power Cycling of Sintered SiC Power MOSFET Baseplate-less Modules with Aluminum Oxide and Silicon Nitride Substrates

Kovacevic-Badstuebner
1
,
Mengotti
2
,
Natzke
3
et al. 2023
2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
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In Situ Detection of Bond Wire Lift-Off Events in Operational SiC MOSFETs

Karakaya,
Maheshwari,
Banerjee
et al. 2024
IEEE Trans. Power Electron.
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