2015 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe) 2015
DOI: 10.1109/epe.2015.7309159
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Extension of power transmission capacity in MMC-based HVDC systems through dynamic temperature-dependent current limits

Abstract: This paper proposes the extension of the current control loops used in Modular Multilevel Converters to include semiconductors junction temperature as an operational constraint. A new controller is added to the inner current loop to modulate the current limits as a function of the temperature, providing an extension of the power transmission capacity without violating the thermal limits of the semiconductors. A numerical method to investigate the operation of converters with temperaturedependent current limits… Show more

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Cited by 5 publications
(8 citation statements)
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“…Where is the nominal current of the system, ( ) is the nominal operating junction temperature of the semiconductor switch, and is the temperature droop constant and it denote the decrease in current limit per unit increase in temperature and is given by [17]:…”
Section: B Isolation Dab Control Blockmentioning
confidence: 99%
“…Where is the nominal current of the system, ( ) is the nominal operating junction temperature of the semiconductor switch, and is the temperature droop constant and it denote the decrease in current limit per unit increase in temperature and is given by [17]:…”
Section: B Isolation Dab Control Blockmentioning
confidence: 99%
“…The proposed submodule temperature control loop regulates SM capacitor voltages to prevent SM temperature from reaching dangerous values and must therefore avoid temperature overshoots. Using the principle of bandwidth separation between the cascaded loops and neglecting constant disturbances, the open-loop transfer function G (s) of the system can be defined as follows: (10) where the gain K c is defined as follows:…”
Section: B Stability Of Submodule Temperature Regulationmentioning
confidence: 99%
“…In HVdc systems, where dozens or hundreds of SMs per 587 arm are employed, the switching frequency of each individual 588 device will be very low, reducing the proportion of switching losses in the overall semiconductor losses. This is investigated through the reduction of the switching frequency of 500 Hz of the MMC with ten SMs per arm from [10], utilized for the results in Fig. 10(a), to 150 Hz.…”
Section: Operation At Low Switching Frequency 586mentioning
confidence: 99%
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“…In [7]- [9] the influence of converter temperature dynamics on the achievable overload were neglected. Overload capability of MMC-based HVDC systems considering the temperature dynamics within the converter has arguably only been discussed in [10] and [11]. However, in [11], simplified temperature dynamics were used and implications on the converter design were not addressed.…”
Section: Introductionmentioning
confidence: 99%