2019
DOI: 10.3390/en12091628
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Extraction of Boundary Condition Independent Dynamic Compact Thermal Models of LEDs—A Delphi4LED Methodology

Abstract: Multi-domain electro-thermal-optical models of LEDs are required so that their thermal and optical behavior may be predicted during a luminaire design process. Today, no standardized approach exists for the extraction of such models. Therefore, models are not readily provided by LED suppliers to end-users. This results in designers of LED-based luminaires wasting time on LED characterization and ad hoc model extraction themselves. The Delphi4LED project aims to address these deficiencies by identifying standar… Show more

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Cited by 18 publications
(18 citation statements)
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“…At the chip level, a physics-based model is created by using characteristics derived from measurements while at the package level a dynamic thermal compact model is created in two steps. First a detailed thermal model of the LED package structure is set up and "calibrated" with the help of structure functions derived from the measured thermal impedance, ( ) of the package and then, in a subsequent step, thermal capacitance and thermal resistance values of a thermal RC network model of the package are optimized to best represent the thermal properties of the LED package under any boundary conditions at the package footprints and the LED's dome (lens) [8]. (1) a boundary condition-independent compact thermal model of the physical LED package and (2) a multi-domain, so called Spice-like, model that describes the LED operation at the chip level [7].…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…At the chip level, a physics-based model is created by using characteristics derived from measurements while at the package level a dynamic thermal compact model is created in two steps. First a detailed thermal model of the LED package structure is set up and "calibrated" with the help of structure functions derived from the measured thermal impedance, ( ) of the package and then, in a subsequent step, thermal capacitance and thermal resistance values of a thermal RC network model of the package are optimized to best represent the thermal properties of the LED package under any boundary conditions at the package footprints and the LED's dome (lens) [8]. (1) a boundary condition-independent compact thermal model of the physical LED package and (2) a multi-domain, so called Spice-like, model that describes the LED operation at the chip level [7].…”
Section: Methodsmentioning
confidence: 99%
“…A LED digital twin, also called multi-domain compact model [7,[14][15][16][17], is created. This includes a dynamic compact thermal model of the mechanical structure of the LED package [8]. 4.…”
Section: Methodsmentioning
confidence: 99%
“…In the bottom-up modular approach, the modelling starts from a multi-domain model of LED chips [5][6][7], followed by compact thermal models of the LED packages, modules (orange framed items in Figure 1), and finally, luminaires [8,9]. Details of the compact modelling of the 3D thermal environment of LED chips (package, substrate, luminaire with optics) are provided in other publications, such as [8,10,11]. In the "Industry 4.0" language, these simulation models are called "digital twins" to represent the relevant aspects of the physical samples of LED chips, LED packages, modules, etc.…”
Section: The Context Of This Workmentioning
confidence: 99%
“…A further stage in the evolution of our model is that the I dis component is no longer calculated, since through the use of Equations (2) and (3), an LED as a "diode" is described and Equations (10) and (11) yield the radiant flux. From this, and using Equation (9), the total dissipated power heating the LED is calculated.…”
Section: Model Equations At a Fixed Reference Temperature T Re F Imentioning
confidence: 99%
“…The problem of fractal heat conduction describes heat transport in inhomogeneous materials as fibrous materials, coal deposits, textiles and other discontinuous media where homogenization is not acceptable because this approach neglects the important physical characteristics of transport processes. Non-smoothness raises problems and avoids the implementation of classical calculus a fractional and integer-order [5][6][7].…”
Section: Introductionmentioning
confidence: 99%