13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2012
DOI: 10.1109/itherm.2012.6231424
|View full text |Cite
|
Sign up to set email alerts
|

Extreme energy efficiency using water cooled servers inside a chiller-less data center

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
10
0

Year Published

2015
2015
2021
2021

Publication Types

Select...
3
3
2
1

Relationship

0
9

Authors

Journals

citations
Cited by 15 publications
(10 citation statements)
references
References 6 publications
0
10
0
Order By: Relevance
“…Studies are e.g. by Zimmermann et al [79,80] (hot water-cooled electronics and heat reuse; energy performance of Aquasar, the first hot water-cooled prototype), Coles et al [81] (direct liquid cooling), Iyengar et al [82,83] (experimental on IBM chiller-less test facility). Commercial systems are proposed e.g.…”
Section: Liquid Coolingmentioning
confidence: 99%
“…Studies are e.g. by Zimmermann et al [79,80] (hot water-cooled electronics and heat reuse; energy performance of Aquasar, the first hot water-cooled prototype), Coles et al [81] (direct liquid cooling), Iyengar et al [82,83] (experimental on IBM chiller-less test facility). Commercial systems are proposed e.g.…”
Section: Liquid Coolingmentioning
confidence: 99%
“…Studies are e.g. by Zimmermann et al [96,97] (hot water-cooled electronics and heat reuse; energy performance of Aquasar, the first hot water-cooled prototype), Coles et al [98] (direct liquid cooling), Iyengar et al [99,100] (experimental on IBM chiller-less test facility). Commercial systems are proposed e.g.…”
Section: Liquid Coolingmentioning
confidence: 99%
“…While several reports have discussed the use of hybrid air-liquid cooling by servers and in data centers [14,15,16,17], there has been little discussion of air flow and ducting for the auxiliary components. The server chassis with a form factor 2OU (88.9 mm) incorporates Intel Xeon 2570 dual CPUs, each dissipating a thermal design power (TDP) of 115W; specifications of the processor available in [21].…”
Section: Need For Liquid Coolingmentioning
confidence: 99%