“…This structuring process is remarkable by its dimensions and thus new approaches for the conception of the 3D photonic crystals, phonon crystals, metamaterials, integrated photonics devices, beam welding, and plasmonic devices could rely on this unique fabrication technique [ 11 , 12 , 13 , 14 , 15 ]. Typically, these embedded holes have taper-free profiles, hundreds of nanometers in diameter and a few hundreds of micrometers in-depth, as reported for example in fused silica and sapphire [ 10 , 16 ]. Notwithstanding the effectiveness of short pulse duration Gaussian-Bessel beams for drilling high aspect ratio channels, it is also possible to precisely manipulate the characteristics of the fabricated holes and to access diverse aspect ratios by regulating the beam parameters [ 17 , 18 , 19 ] or by phase engineering [ 20 , 21 ].…”