2008
DOI: 10.1016/j.apsusc.2007.11.059
|View full text |Cite
|
Sign up to set email alerts
|

Fabrication and analysis of ZnO thin film bulk acoustic resonators

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
8
0

Year Published

2009
2009
2024
2024

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 20 publications
(8 citation statements)
references
References 10 publications
0
8
0
Order By: Relevance
“…A variety of piezoelectric materials such as zinc oxide (ZnO), lead zirconate titanate (PZT), aluminium nitride (AlN), gallium arsenide (GaAs) and polyvinylidene fluoride (PVDF) have been used in FBARs (Bjurstrom et al 2006;DeMiguel-Ramos et al 2017;DeMiguel-Ramos et al 2014;Kim et al 2003;Lin et al 2008c;Mai et al 2004;Qiu et al 2011;Sapsford and Ligler 2004). Each of them has strengths and weaknesses.…”
Section: Piezoelectric Films Employed In Fbarsmentioning
confidence: 99%
“…A variety of piezoelectric materials such as zinc oxide (ZnO), lead zirconate titanate (PZT), aluminium nitride (AlN), gallium arsenide (GaAs) and polyvinylidene fluoride (PVDF) have been used in FBARs (Bjurstrom et al 2006;DeMiguel-Ramos et al 2017;DeMiguel-Ramos et al 2014;Kim et al 2003;Lin et al 2008c;Mai et al 2004;Qiu et al 2011;Sapsford and Ligler 2004). Each of them has strengths and weaknesses.…”
Section: Piezoelectric Films Employed In Fbarsmentioning
confidence: 99%
“…According to the literature, the reactive sputtering technique has received a great interest because of its advantages for film growth, such as easy control for the preferred crystalline orientation, epitaxial growth at relatively low temperature, good interfacial adhesion to the substrate and the high packing density of the grown film. These properties are mainly caused by the kinetic energy of the clusters given by electric field (Molarius et al, 2003;Lin et al, 2008;Kim et al, 1997). This energy enhances the surface migration effect and surface bonding state.…”
Section: Introductionmentioning
confidence: 99%
“…6 Experimental Section FBAR devices were fabricated on 4" silicon wafers using a 4-mask process. 7 Vias were formed through the ZnO for electrical connection to the bottom electrodes. The device working areas ranged from 50µm x 50µm to 200µm x 200µm.…”
Section: Introductionmentioning
confidence: 99%