2011 IEEE 24th International Conference on Micro Electro Mechanical Systems 2011
DOI: 10.1109/memsys.2011.5734517
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Fabrication and characterization of 3D integrated 2 DOF Micromirror Arrays for excessive thermal loads

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“…This fabrication methodology would be promising for various applications since copper exhibits properties of low resistance, high current carrying capability and scalability which promote its ability to support high current density and viability for micro-devices [24][25][26][27][28].…”
Section: Introductionmentioning
confidence: 99%
“…This fabrication methodology would be promising for various applications since copper exhibits properties of low resistance, high current carrying capability and scalability which promote its ability to support high current density and viability for micro-devices [24][25][26][27][28].…”
Section: Introductionmentioning
confidence: 99%