Efficient exploitation of agricultural waste results in a more sustainable and ecofriendly environment since it lessens the burden of their disposal, which has become increasingly important in recent times. Due to their high mechanical strength and high thermal stability, these biodegradable low-value agrosolid wastes have the potential to successfully replace synthetic fibers and fillers in polymer matrices in the form of reinforcements. This work deals with the addition of low-cost and renewable hybrid natural fillers, tamarind seed filler (TMS), and peanut shell powder (PNS) as particulate reinforcements to the vinyl ester (VE) resin. Traditional compression molding creates TMS/PNS-VE hybrid composites with filler loadings ranging from 5% to 30%. After the composites were fabricated, they were tested for strength properties and heat deflection temperature. A detailed experimental analysis of the mechanical properties was conducted. According to the findings, 20 wt.% hybrid filler loading to the vinyl ester polymer exhibited peak tensile, flexural, and impact strengths of 40.3 MPa, 142 MPa, and 16 kJ/m2, respectively, which is 1.52, 1.69, and 1.29 times the properties of the virgin polymer. However, the peak elongation at break 3.9% was obtained at 30 wt.%. Similarly, the heat deflection temperature (HDT) test of TMS/PNS-VE composites showed a maximum rise of 50.91% at 25 wt.% of filler loading. This is 1.51 times greater than the heat deflection temperature of the pure vinyl ester resin. The findings made it quite clear that adding 20 wt.% biosolid waste hybrid particulate fillers made out of tamarind seed and peanut shell to vinyl ester is the optimum weight, which improves the mechanical and thermal properties of the TMS/PNS-VE composite, making it suitable for making cost-effective materials for lightweight applications. This study also utilizes scanning electron microscopy (SEM) to investigate the microstructural characteristics of the composites, correlating these features with their mechanical performance.