Fabrication and Characterization of Millimeter Wave 3D InFO Dipole Antenna Array Integrated with CMOS Front-end Circuits

Tsai, Chien‐Hsiung; Wu, Tzong‐Lin; Liu, C. S.; Wang, C. T.; Yu, Douglas; Hsu, Chih-Hao; Kao, Kun-Yao; Tang, Tzu-Chun; Lu, Calvin; Wu, K.; Pu, H. P.; Lin, K. Y.; Wang, H.

doi:10.1109/iedm19573.2019.8993591

Cited by 5 publications

(2 citation statements)

References 4 publications

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“…Advanced Semiconductor Engineering (ASE) reported, in 2019, the FOWLP processes for stacked-patch antennas to enhance the bandwidth [99]. TSMC has reported InFO-based antenna-integrated packages with beamforming capability of the antenna array system with 6 dBi gain in a 40-nm CMOS RFIC co-designed system [88]. Tsai et al reported an antenna-integrated wafer-level package with a size of 10×10×0.5 mm 3 , which shows an antenna-array gain of 14.7 dBi at the 60 GHz band [100].…”

Section: Antenna Systems In Package (Aip)mentioning

confidence: 99%

A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

158

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Increasing data rates, spectrum efficiency and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, 5G networks have emerged as a follow-on to 4G, and projected to have 100X higher wireless date rates and 100X lower latency than those with current 4G networks. Major challenges arise in the packaging of radio-frequency front-end modules because of the stringent low signal-loss requirements in the millimeter-wave frequency bands, and precision-impedance designs with smaller footprints and thickness. Heterogeneous integration in 3D ultra-thin packages with higher component densities and performance than with the existing 2D packages is needed to realize such 5G systems. This paper reviews the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them.

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Section: Antenna Systems In Package (Aip)mentioning

confidence: 99%

A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

158

View full text Add to dashboard Cite

show abstract

“…Recently, the stacked 3D packaging can integrate RF, analog, digital, power management chipsets, passive devices, and antenna in one package while maintaining miniaturization. Besides, the component density of 3D packaging is higher than that of 2D packages, which reduces the feed-line loss between the devices and improves the system performance [8,16,17]. Most importantly, the integrated antenna overcomes the shortcomings of discrete antennas that are difficult to integrate into the system using connector interconnections.…”

Section: Introductionmentioning

confidence: 99%

A 37-43 GHZ Endfire Antenna Element Based on Ball Grid Array Packaging for 5g Wireless Systems

Liu¹,

Zhang²,

Hao³

et al. 2021

PIER Letters

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A 37-43 GHz endfire antenna based on ball grid array (BGA) packaging is proposed for the fifth-generation (5G) wireless system. The antenna consists of a miniaturized radiator and reflector. Besides, the radiator is fed by a substrate integrated waveguide (SIW). Furthermore, the RF transition from the SIW to grounded coplanar waveguide (GCPW) and vertical quasi-coaxial is realized on the substrate. The antenna is implemented on a single-layer substrate using standard printed circuit board (PCB) technology to reduce costs. Then, the cost-effective antenna element is reflow soldered with solder balls to form a BGA packaging. The advantages of the BGA packaging and the threedimensional (3D) integration are discussed in detail. The miniature packaging achieves a compact size of 7 mm × 3.4 mm × 0.6 mm. Finally, a prototype was manufactured to verify the performance. The measurement results show that the proposed antenna is a good candidate for 5G millimeter-wave (mmWave) New Radio (NR) applications.

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Antenna‐in‐Package Design for Wireless System on a Chip

Zhang

2022

Antenna and Array Technologies for Future Wireless Ecosystems

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Fabrication and Characterization of Millimeter Wave 3D InFO Dipole Antenna Array Integrated with CMOS Front-end Circuits

Cited by 5 publications

References 4 publications

A Review of 5G Front-End Systems Package Integration

A Review of 5G Front-End Systems Package Integration

A 37-43 GHZ Endfire Antenna Element Based on Ball Grid Array Packaging for 5g Wireless Systems

Antenna‐in‐Package Design for Wireless System on a Chip

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