Fabrication and characterization of stress‐free microbeams for MEMS applications

Abstract

The construction of a high sensitivity micro-accelerometer using the tunnelling/cold-emission for the displacement measurement of a probe mass is considered. In particular, the fabrication of stress-free microconsoles based on Ta 2 O 5 or GaAs for accelerometer applications is discussed. The mechanical properties of these microconsoles are investigated. The microconsoles are positioned near the substrate surface. Additional bending of the consoles was carried out by sputtering of stressed metal layers on the consoles. By varying the thickness of the metal layer, it is possible to precisely adjust the direction and curvature of the bended consoles and, so, the distance to the substrate.