Fabrication and characterization of three-dimensional silicon tapers

Sure, Anita; Dillon, Thomas E.; Murakowski, Janusz; Chang-hu, Lin; Pustai, David; Prather, Dennis W.

doi:10.1364/oe.11.003555

Cited by 144 publications

(62 citation statements)

References 7 publications

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“…The possibility of creating profiled micro 3D structures offers tremendous additional flexibility in the design of microfluidic, microelectronic, optoelectronic and micromechanical components. A number of techniques have been used to implement grayscale photolithography; for example, magnetron sputtering of amorphous carbon (a-C) onto a quartz substrate where transmittance can be tailored by controlling the carbon film thickness within 0-200 nm with subnanometer precision [34]; high energy beam sensitive (HEBS) glass, which turns dark upon exposure to an electron beam, has also been used to fabricate grayscale masks: the higher the electron dosage, the darker the glass turns [35]. Yet another approach is the use of colored masks as demonstrated by Taff and colleagues [36], where they first characterized the UV absorption of different colors and then printed them on transparent film using a standard laser color printer.…”

Section: Grayscale Photolithographymentioning

confidence: 99%

SU-8 Photolithography as a Toolbox for Carbon MEMS

Martínez-Duarte

2014

Micromachines

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Abstract:The use of SU-8 as precursor for glass-like carbon, or glassy carbon, is presented here. SU-8 carbonizes when subject to high temperature under inert atmosphere. Although epoxy-based precursors can be patterned in a variety of ways, photolithography is chosen due to its resolution and reproducibility. Here, a number of improvements to traditional photolithography are introduced to increase the versatility of the process. The shrinkage of SU-8 during carbonization is then detailed as one of the guidelines necessary to design carbon patterns. A couple of applications-(1) carbon-electrode dielectrophoresis for bioparticle manipulation; and (2) the use of carbon structures as micro-molds are also presented.

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Section: Grayscale Photolithographymentioning

confidence: 99%

SU-8 Photolithography as a Toolbox for Carbon MEMS

Martínez-Duarte

2014

Micromachines

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“…Improving the coupling effi ciency is therefore a major task in device engineering to facilitate the further commercialization of OEICs. End-fi re coupling techniques using inverse tapers [52,53], grating directional couplers [54] and 3D tapers [55] as mode converter have been studied. Coupling effi ciency of better than -1 dB can normally be achieved using the inverse taper approach, the best results for which, 0.25 dB polarization-insensitive coupling loss and a 1 dB bandwidth of 150 nm, were obtained recently by Bakir et al [56].…”

Section: Fiber-chip Couplingmentioning

confidence: 99%

Device engineering for silicon photonics

Chen

Tsang

2011

NPG Asia Mater

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A fter an impressive initial spurt of progress in device engineering during the early 2000s when the optical communications industry saw unprecedented levels of investment, silicon photonics continues to develop at an amazing pace. Many novel applications and devices are emerging. Silicon photonics has the potential to become a major platform for optoelectronic integrated circuits (OEICs) and to be used in high-speed optical interconnects for chip-level data communications because of the extremely large bandwidth and high speed off ered by optical communications. Many challenges have been addressed through the introduction of innovative ideas, paving the way for the practical deployment of silicon-based optoelectronic devices and integrated photonic circuits in computing and telecommunication systems [1]. Th e commercialization of silicon photonics, originally driven by applications in telecommunications, is now also driven by the needs of the computing industry for highspeed, energy-effi cient optical cable technology, such as the Light Peak Technology under development by Intel (USA). Th e California-based company Luxtera (USA) has also commercialized a series of siliconphotonic transceiver systems.Silicon off ers many advantages over alternative material systems (e.g. InP, GaAs, LiNbO 3 ) for OEIC applications. One major reason for the wide interest that silicon photonics is attracting is the cost advantage that silicon photonics can potentially off er through its compatibility with the complementary metal-oxide-semiconductor (CMOS) fabrication processes used in the microelectronics industry. Th e huge investments that have been made in CMOS microelectronics fabrication technologies has resulted in processes that off er much higher yield than is possible using alternative materials for photonics, thus making feasible large-scale integration and the production of silicon-photonic devices that are monolithically integrated with not only optical components but also electronic circuits in the same platform at ultrahigh density. Another reason for the attractiveness of silicon photonics is the high refractive index contrast between the silicon core (refractive index, 3.48) and silicon dioxide cladding (refractive index, 1.45) in silicon-on-insulator (SOI) devices, which ensures the submicrometer confi nement of light and allows tight bending in optical waveguides. Th e high-density integration of photonic circuits on SOI platforms is thus feasible. Th e low cost of high-quality SOI wafers is another advantage of silicon photonics. All kinds of low-cost devices enabled by silicon photonics are therefore predicted, and these may also enjoy the other benefi ts of monolithic integration: smaller size, increased power effi ciency and improved reliability. Figure 1 shows an example of a high-density integrated photonics devices fabricated on a 6-inch SOI wafer using CMOS-compatible technology.In this article, we review some of the exciting progress that has been made in silicon photonics with the aim of providing a broa...

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“…Whilst this reduction enhances the performance of the photonic circuit, it makes coupling of light to/from the circuit very difficult, particularly to/from standard optical fibres that typically have a core dimension of ~ 9 µm. Consequently several devices have been proposed for efficient coupling to/from the silicon photonic circuit [8][9][10][11][12] but none have yet produced satisfactory performance. We have previously presented theoretical work of an alternative device entitled the Dual Grating Assisted Directional Coupler (DGADC) [13,14] that predicted efficiencies as high as 97%.…”

Section: Introductionmentioning

confidence: 99%

“…However, for waveguide dimensions smaller than 3 µm, the insertion loss (IL) increases rapidly reaching up to 2.5 dB for a width of 2 µm. Sure et al [9] fabricated more efficient 3D adiabatic tapers using a gray scale mask. The theoretical coupling efficiency to a 0.25 µm thick silicon waveguide was 82%, while the value measured was 45%.…”

Section: Introductionmentioning

confidence: 99%

A high efficiency input/output coupler for small silicon photonic devices

Masanovic¹,

Reed²,

Headley³

et al. 2005

Opt. Express

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Abstract:Coupling light from an optical fibre to small optical waveguides is particularly problematic in semiconductors, since the refractive index of the silica fibre is very different from that of a semiconductor waveguide. There have been several published methods of achieving such coupling, but none are sufficiently efficient whilst being robust enough for commercial applications. In this paper experimental results of our approach called a Dual-Grating Assisted Directional Coupler, are presented. The principle of coupling by this novel method has been successfully demonstrated, and a coupling efficiency of 55% measured. O. Boyraz and B. Jalali, "Demonstration of 11dB fiber-to-fiber gain in a silicon Raman amplifier," IEICE Elect. Express 1, 429-434 (2004

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Fabrication and characterization of three-dimensional silicon tapers

Cited by 144 publications

References 7 publications

SU-8 Photolithography as a Toolbox for Carbon MEMS

SU-8 Photolithography as a Toolbox for Carbon MEMS

Device engineering for silicon photonics

A high efficiency input/output coupler for small silicon photonic devices

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