Fabrication and Characterization of Two‐Photon Polymerized Features in Colloidal Crystals

Pruzinsky, Stephanie A.

doi:10.1002/adfm.200500345

Cited by 66 publications

(57 citation statements)

References 68 publications

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“…3.1.5) to fabricate high-resolution 3D embedded polymer features within CCs. [131] After infiltrating the CC with a twophoton polymerizable resin, a localized excitation volume is scanned throughout the material to expose the desired regions, defining high-resolution 3D embedded features ( Fig. 15a and b).…”

Section: D Embedded Defects Via Multistep Proceduresmentioning

confidence: 99%

Introducing Defects in 3D Photonic Crystals: State of the Art

2006

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Public Reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comment regarding this burden estimates or any other aspect of this collection of information, including suggestions for reducing this burden, to Washington Headquarters Services, Directorate for information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office of Management and Budget, Paperwork Reduction Project (0704-0188,) Washington, DC 20503. AGENCY USE ONLY ( Leave Blank)2. REPORT DATE Advanced Materials, 18, 2665-2678 (2006). 3D photonic crystals (PhCs) and photonic bandgap (PBG) materials have attracted considerable scientific and technological interest. In order to provide functionality to PhCs, the introduction of controlled defects is necessary; the importance of defects in PhCs is comparable to that of dopants in semiconductors. Over the past few years, significant advances have been achieved through a diverse set of fabrication techniques. While for some routes to 3D PhCs, such as conventional lithography, the incorporation of defects is relatively straightforward; other methods, for example, selfassembly of colloidal crystals (CCs) or holography, require new external methods for defect incorporation. In this review, we will cover the state of the art in the design and fabrication of defects within 3D PhCs. The figure displays a fluorescence laser scanning confocal microscopy image of a y-splitter defect formed through two-photon polymerization within a CC. SUBJECT TERMS 15. NUMBER OF PAGES 1416. PRICE CODE SECURITY CLASSIFICATION OR REPORT UNCLASSIFIED SECURITY CLASSIFICATION ON THIS PAGE UNCLASSIFIED SECURITY CLASSIFICATION OF ABSTRACT UNCLASSIFIED LIMITATION OF ABSTRACT UL IntroductionPhotonic crystals (PhCs) are materials that possess spatial periodicity in their dielectric constant on the order of the wavelength (k) of light. These materials can strongly modulate light [1] and, with sufficient dielectric contrast and an appropriate geometry, may exhibit a photonic bandgap (PBG). This concept was first proposed in 1975 by Bykov [2] but remained relatively unknown until the seminal work of Yablonovitch [3] and John. [4] In a rough analogy to semiconductors, which possess an electronic bandgap, a PBG material prohibits the existence of photons with energies in the PBG. PhCs are naturally classified by the dimensionality of their periodicity, and in order to rigorously prevent the propagation of PBG frequencies in all directions, a 3D PhC with an omnidirectional, or complete PBG (cPBG) is required. cPBG materials have been fabricated and well characterized for operation at microwave and radio frequencies, however, operation in the visible and IR requires the characteristic length scales of these structures to be scaled down by several orders of magnitude...

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Section: D Embedded Defects Via Multistep Proceduresmentioning

confidence: 99%

Introducing Defects in 3D Photonic Crystals: State of the Art

2006

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“…Some notable examples include the introduction of purposeful defects or creation of local hierarchical structures in 3D media patterned either by interference lithography (IL) [10][11][12], or colloidal/block copolymer self-assembly [13][14][15][16]. All of these techniques are capable of fabricating structures with periodic or quasiperiodic substructures that could only be patterned by 3DDW, but at a fraction of the time.…”

Section: Introductionmentioning

confidence: 99%

Rapid fabrication of 3D terahertz split ring resonator arrays by novel single-shot direct write focused proximity field nanopatterning

et al. 2012

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For the next generation of phoXonic, plasmonic, optomechanical and microfluidic devices, the capability to create 3D microstructures is highly desirable. Fabrication of such structures by conventional top-down techniques generally requires multiple timeconsuming steps and is limited in the ability to define features spanning multiple layers at prescribed angles. 3D direct write lithography (3DDW) has the capability to draw nearly arbitrary structures, but is an inherently slow serial writing process. Here we present a method, denoted focused proximity field nanopatterning (FPnP), that combines 3DDW with single or multiphoton interference lithography (IL). By exposing a thick photoresist layer having a phase mask pattern imprinted on its surface with a tightly focused laser beam, we produce locally unique complex structures. The morphology can be varied based on beam and mask parameters. Patterns may be written rapidly in a single shot mode with arbitrary positions defined by the direct write, thus exploiting the control of 3DDW with the enhanced speed of phase mask IL. Here we show the ability for this technique to rapidly produce arrays of "stand-up" far IR resonators.

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“…[1,2,5] Engineered defects within opal-based photonic crystals are generally made by surface modification [10][11][12] followed by overgrowth, [12] leading to essentially 2D device layouts, although 3D structures created by multiphoton polymerization of infiltrated resin have been demonstrated. [13][14][15] Autocloning, electrochemical etching, and wafer fusion also restrict defect geometries. [16][17][18][19] The most flexible approach uses planar electron-beam lithography to build structures layer by layer; defects can be incorporated at any depth [20,21] but the overall thickness is limited by the processing time and by the build up of thermal stresses.…”

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confidence: 99%

Three‐Dimensional Optical Lithography for Photonic Microstructures

et al. 2006

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Microcavities[1] and waveguides [2] operating within the optical bandgap of a photonic crystal [3,4] have the potential to create integrated optical devices capable of all-optical signal processing. [5] To achieve this degree of control over visible or near-infrared light is a materials-engineering challenge requiring precise local modification of wavelength-scale microstructure.In this communication we demonstrate a rapid and flexible technique for optical fabrication by creating a device embedded in, and in registration with, a 3D photonic crystal. We use holographic lithography to define the underlying periodic microstructure in a single exposure, [6] and direct twophoton laser writing [7][8][9] to create localized structural defects.An intermediate latent image of the photonic crystal is used to align the two exposure processes. Optical devices based on waveguides and resonators embedded within a photonic crystal have the potential to integrate high-frequency optical-signal-processing functions;[5] use of 3D photonic crystals can, in principle, eliminate the radiative losses that plague 2D photonic-crystal devices. Many elegant techniques for 3D photonic-crystal fabrication have been demonstrated, but not all lend themselves to the controlled introduction of the structural 'defects' from which devices operating within the photonic bandgap are constructed. [1,2,5] Engineered defects within opal-based photonic crystals are generally made by surface modification [10][11][12] followed by overgrowth, [12] leading to essentially 2D device layouts, although 3D structures created by multiphoton polymerization of infiltrated resin have been demonstrated. [13][14][15] Autocloning, electrochemical etching, and wafer fusion also restrict defect geometries. [16][17][18][19] The most flexible approach uses planar electron-beam lithography to build structures layer by layer; defects can be incorporated at any depth [20,21] but the overall thickness is limited by the processing time and by the build up of thermal stresses. Two new optical-lithography techniques are intrinsically well adapted to 3D photonic-crystal device fabrication. The fastest of these-holographic lithography-uses a 3D interference pattern, created at the intersection of four laser beams, to define periodic microstructure within a photoresist in a single step; [6] exposure to a single, few-nanosecond Q-switched laser pulse is sufficient. This is a flexible method for fabricating polymeric photonic-crystal templates for the creation of structures with higher refractive-index contrast.[22] (3D structures can also be defined by an interference pattern formed by illumination through a 2D phase mask, [23] although the design and fabrication of photonic-crystal devices by this method has not yet been demonstrated.) Alternatively, 3D microstructures can be made by exploiting the quadratic intensity dependence of two-photon absorption. [7][8][9] Two-photon photoexcitation by an infrared writing beam is effectively confined to a small focal volume where the intensi...

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Fabrication and Characterization of Two‐Photon Polymerized Features in Colloidal Crystals

Cited by 66 publications

References 68 publications

Introducing Defects in 3D Photonic Crystals: State of the Art

Introducing Defects in 3D Photonic Crystals: State of the Art

Rapid fabrication of 3D terahertz split ring resonator arrays by novel single-shot direct write focused proximity field nanopatterning

Three‐Dimensional Optical Lithography for Photonic Microstructures

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