Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration

Guan, Yong Liang; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng

doi:10.1109/tcpmt.2017.2695647

Cited by 1 publication

(1 citation statement)

References 24 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This technology is important for novel artificial intelligence (AI) machine design using graphical processing units (GPU) architectures for example. 3D integration requires through silicon via‐contacts and various contacts, such as contacts that use either bumps or “bumpless” contacts [40] . 3D integration also offers other advantages:…”

Section: Three‐dimensional Integration Of Circuits and Systemsmentioning

confidence: 99%

Electrochemistry and Microelectronics, Perspective and Prospective

Shacham‐Diamand¹

2021

Israel Journal of Chemistry

View full text Add to dashboard Cite

Modern electrochemistry contributes significantly to the field of Micro-System-Technologies (MST). MST is the base of the global information and communication technology (ICT) driving most aspects of modern life. MST includes Micro and Nano scale manufacturing disciplines such as microelectronics, micro electro mechanical systems, microelectro-optics, microfluidics and more. MST, since its conception, involved many aspects of applied electrochemistry: process modules (i. e. deposition, etching, cleaning etc.), devices (i. e. biosensing, chemical sensing etc.), and energy components (i. e. sources, energy harvesting, storage etc.). We present a brief historical overview, followed by a discussion about the main topic of this work, electrochemistry and MST. To highlight the electrochemistry contribution, two examples are presented demonstrating when electrochemistry provided critical micro technologies. The first is Very Large-Scale Integration copper metallization, which is already in mass production, and the second is 3D integration of circuits and systems, which is under intense research and development.

show abstract

Section: Three‐dimensional Integration Of Circuits and Systemsmentioning

confidence: 99%

Electrochemistry and Microelectronics, Perspective and Prospective

Shacham‐Diamand¹

2021

Israel Journal of Chemistry

View full text Add to dashboard Cite

show abstract

Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration

Cited by 1 publication

References 24 publications

Electrochemistry and Microelectronics, Perspective and Prospective

Electrochemistry and Microelectronics, Perspective and Prospective

Contact Info

Product

Resources

About