High‐density polyethylene (HDPE) nanocomposites containing different optimized fractions of carbon nanofiber (CNF) at 6 wt.%, polyethylene glycol (PEG) at 4 wt.%, and copper oxide (CuO) nanorods in concentration ranges of 0.15, 0.5, and 2 wt.% were successfully melt processed using corotating twin extrusion and compression molding technique. The effect of PEG and CuO nanofiller on the HDPE matrix were studied, particularly for the percolation threshold for electrical conductivity, structural morphology, and other properties including thermal stability, thermal conductivity (TC), dielectric, and UV protection properties. It is observed that PEG acts as a good compatibilizer, facilitating better interfacial connection between CNF and HDPE matrix. The optimized composite with 0.15 wt.% CuO nanorods (H/C6/P4/Cu0.15) shows a fine morphology and strong interfacial connections between fillers and the matrix, as observed in FE‐SEM micrographs. This optimized composite exhibits improved thermal stability, higher thermal conductivity (0.0404 W.K−1.m−1), increased dielectric constant, reduced electrical volume resistivity (from 2.1 × 1015 to 2.1 × 106 Ω.cm), and lower optical band gap value (2.74 eV). Additionally, all prepared nanocomposites offer approximately 100% Ultraviolet Protection Factor (UPF) rating for UV protection.Highlights
The transformation of insulating HDPE into conducting HDPE composites.
The effect of CuO nanorods was investigated in compatibilized HDPE composites.
A percolation is achieved in the HDPE composite at 0.15 wt.% of CuO nanorods.
PEG and CuO nanorods improved the multifunctional properties of the composite.