Fabrication and Formation Principle of Porous Cu–Sn Bumps for Metal Bonding in Chiplet Integration

Wang, Zilin; Wang, Ziqing; Shi, Yunfan; Wang, Qian; Wang, Zheyao

doi:10.1109/tcpmt.2024.3485112

IEEE Trans. Compon., Packag. Manufact. Technol.

2024

DOI: 10.1109/tcpmt.2024.3485112

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Fabrication and Formation Principle of Porous Cu–Sn Bumps for Metal Bonding in Chiplet Integration

Zilin Wang,

Ziqing Wang,

Yunfan Shi

et al.

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Fabrication and Formation Principle of Porous Cu–Sn Bumps for Metal Bonding in Chiplet Integration

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References 57 publications

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