Fabrication and peeling behavior of thermally conductive pressure-sensitive adhesive films with embedded graphite composite patterns
Sang-Ah Oh,
Sangwoong Baek,
Hyesun Yun
et al.
Abstract:Thermal interface materials (TIMs) have been widely employed to address the thermal issues arising in electronics. Given that heat generated at heat sources is dissipated into heat sinks through TIMs, the softer they are, the more efficient the heat transfer is. In this paper, a thermally conductive pressure-sensitive adhesive film (gr-PSA film) in which graphite composites patterns were embedded was fabricated and its thermal conductivity and peeling behavior were investigated. Because of its low storage modu… Show more
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