Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding

Wu, John A.; Huang, Chih Yang; Wu, Wen‐Wei; Chen, Chih

doi:10.3390/ma11112287

Cited by 9 publications

(5 citation statements)

References 24 publications

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“…Nanotwinned 111 planes parallel to the substrate surface has been reported 12,17,19,26 . They are observed to exist in columnar fine grains prolonging several micrometers vertical to the substrate, but do not have a preferred direction from the plan view due to grains having other orientations.…”

Section: Resultsmentioning

confidence: 95%

Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films

Chiu¹,

Liu²,

Lin³

et al. 2020

Sci Rep

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Fine grained and nanotwinned Au has many excellent properties and is widely used in electronic devices. We have fabricated $$\langle {110} \rangle $$ ⟨ 110 ⟩ preferred-oriented Au thin films by DC plating at 5 mA/cm2. Microstructure analysis of the films show a unique fine grain structure with a twin formation. Hardness tests performed on electroplated $$\langle {110} \rangle $$ ⟨ 110 ⟩ Au films show a hardness 47% greater than random and untwinned Au. We then achieved direct bonding between two Au $$\langle {110} \rangle $$ ⟨ 110 ⟩ surfaces operating at 200 °C for an hour in a vacuum oven. The highly-oriented $$\langle {110} \rangle $$ ⟨ 110 ⟩ nanotwinned Au films could be an ideal material in many gold products.

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Section: Resultsmentioning

confidence: 95%

Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films

Chiu¹,

Liu²,

Lin³

et al. 2020

Sci Rep

Self Cite

View full text Add to dashboard Cite

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“…Wu et al reported that highly (111)-oriented nanotwinned gold can be fabricated by periodicallyreversed electroplating. Grain growth was observed to eliminate the bonding interface of the two films after annealing at 250 °C for 1h [22].…”

Section: Introductionmentioning

confidence: 99%

Ultra-Thin Cu Nano-Twinned Films Sputtered On Si Wafers for Low Temperature Hybrid Bonding Of Advanced 3D-IC Packages

Yang,

Chen,

Chen

et al. 2024

IJMMME

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The nanotwinned structure has been attracting a great deal of attention due to its excellent mechanical and electrical properties. In this study, ultra-thin nanotwinned Cu (nt-Cu) films with a thickness of 1.5 μm were fabricated by DC magnetron sputtering with moderate substrate bias. Within these films, an equiaxed-grain transition layer only 100-400 nm thick formed between the nanotwinned region and Si substrate and was observed by focused ion beam (FIB). The XRD and EBSD analyses indicated that the as-deposited nanotwinned films had a strong (111) preferred orientation. The surface roughness of the films, as measured with an atomic force microscope (AFM), was below 10 nm, which was sufficiently smooth for chip bonding at low temperature with minor pressure. Direct bonding of Si chips sputtered with such ultra-thin nt-Cu films with a (111) preferred orientation has been evidenced to yield a sound interface, and this bonding method can be applied for the manufacturing of 3D-IC packages.

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“…Wu et al reported that highly (111)-oriented nanotwinned gold can be fabricated by periodically-reversed electroplating. Grain growth was observed to eliminate the bonding interface of the two films after annealing at 250 °C for 1h [22].…”

Section: Introductionmentioning

confidence: 99%

Sputtering of Ultra-thin Cu Nano-twinned Films on Si Wafers for Application in Advanced 3D-IC Packaging

Yang,

Chuang

2023

Proceedings of the 9th World Congress on Mechanical, Chemical, and Material Engineering

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The nanotwinned structure has been attracting a great deal of attention due to its excellent mechanical and electrical properties. In this study, ultra-thin nanotwinned Cu (nt-Cu) films with a thickness of 1.5 um were fabricated by DC magnetron sputtering with moderate substrate bias. Within these films, an equiaxed-grain transition layer only 100-400 nm thick was formed between the nanotwinned region and Si substrate and observed by focused ion beam (FIB). The XRD and EBSD analyses indicated that the as-deposited nanotwinned films had a strong (111) preferred orientation. The surface roughness of the films, as measured with an atomic force microscope (AFM), was below 10 nm, which was sufficiently smooth for chip bonding at low temperature with minor pressure. Direct bonding of Si chips sputtered with such ultra-thin nt-Cu films with (111) preferred orientation has been evidenced to yield a sound interface, and this bonding method can be applied for the manufacturing of 3D-IC packages.

show abstract

Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding

Cited by 9 publications

References 24 publications

Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films

Fabrication and characteristics of highly $$\langle {110} \rangle $$-oriented nanotwinned Au films

Ultra-Thin Cu Nano-Twinned Films Sputtered On Si Wafers for Low Temperature Hybrid Bonding Of Advanced 3D-IC Packages

Sputtering of Ultra-thin Cu Nano-twinned Films on Si Wafers for Application in Advanced 3D-IC Packaging

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