Fabrication of 2D silicon nano-mold by side etch lift-off method

Abstract

Nano-imprint technology is a method of nano-pattern reproduction, has the characteristics of high resolution, high throughput, and low-cost. It can reduce the complexity and cost of the equipment while improving the resolution, which considered a promising industrial production technology. The key to nanoimprinting lies in the mold, and the quality of the mold directly determines the quality of the imprinted graphics. Here, a method for fabricating sub-100 nm concave 2D silicon nano-mold by side etch lift-off is proposed. The effects of different wet etching time and the metal deposition angle on the width of nanochannels were studied. The measurement result of dry etching shows that on the entire 4 inch silicon wafer, the width of the nanochannel varies by 4% and the depth by 2%. The width of the nanochannel between chips varies by 0.7%, and the depth variation is 1%. With this new method, high-precision and large-scale silicon nano-mold can be produced, which has great potential for realizing high-precision and low-cost manufacturing of nano devices.

Fabrication of SU-8 polymer micro/nanoscale nozzle by hot embossing method

“…The concave silicon nano-mold was fabricated on a silicon wafer by side etching lift-off method [21]. The manufacturing process, as illustrated in figure 1, will now be briefly explained.…”

Fabrication of High Aspect Ratio Nano-Channels by Thermal Nano-Imprinting and Parylene Deposition

“…At present, the fabrication methods for nano-channels mainly include high-resolution machining technology [ 13 , 14 , 15 ], sacrificing layer technology [ 16 , 17 ], the crack method [ 18 , 19 ], PDMS deformation [ 20 , 21 ], molecular self-assembly [ 22 , 23 , 24 ], and nano-imprinting technology [ 25 , 26 , 27 ]. The high-resolution machining technology mentioned above uses nanoscale resolution to expose or directly write nano-channels on the substrate, which provides the advantages of flexibility, controllability, high accuracy, and good quality.…”

A low-cost and high-efficiency method for four-inch silicon nano-mold by proximity UV exposure

“…Although interference exposure does not require masks, it also relies on expensive exposure equipment. (3) Special processing method: a variety of MEMS fabrication methods are used to realize the manufacturing of nano-molds through process design, such as side wall machining method [18,19], directional deposition method [20] and transverse corrosion method [21]. These methods do not rely on expensive equipment, but the process is complicated, and production period is long.…”