Fabrication of 3-dimensional microstructures using moving mask deep X-ray lithography (M/sup 2/DXL)

Tabata, Osamu; Matsuzuka, Naoki; Yamaji, Tomohito; You, Hui; Minakuchi, J.; Yamamoto, Kazuo

doi:10.1109/memsys.2001.906487

“…where the weights for , 1, 2 is called triangular coordinates in the FEM (4) We use the cyclic notation between , , and : when , then and ; when , then and ; when , then and . The construction of the linear Lagrange interpolation for variables in 3-D follows the same way as in the 2-D.…”

Section: Triangulated Fast Marching Update Scheme In X3dmentioning

confidence: 99%

“…technique shown in Fig. 1 is one of the highly promising 3-D X-ray lithography techniques to realize 3-D microstructures with free shaped and inclined walls [1], [4], [5]. In , the 3-D microstructure is defined by an X-ray mask trajectory and the resultant dose distribution in resist.…”

Section: Introductionmentioning

confidence: 99%

Validation of X-Ray Lithography and Development Simulation System for Moving Mask Deep X-Ray Lithography

Hirai

¹

,

Hafizovic²,

Matsuzuka

³

et al. 2006

J. Microelectromech. Syst.

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This paper presents a newly developed 3-Dimensional (3-D) simulation system for Moving Mask Deep X-ray Lithography (M 2 DXL) technique, and its validation. The simulation system named X-ray Lithography Simulation System for 3-Dimensional Fabrication (X3D) is tailored to simulate a fabrication process of 3-D microstructures by M 2 DXL. X3D consists of three modules: mask generation, exposure and resist development (hereafter development). The exposure module calculates a dose distribution in resist using an X-ray mask pattern and its movement trajectory. The dose is then converted to a resist dissolution rate. The development module adopted the "Fast Marching Method" technique to calculate the 3-D dissolution process and resultant 3-D microstructures. This technique takes into account resist dissolution direction that is required by 3-D X-ray lithography simulation. The comparison between simulation results and measurements of "stairs-like" dose deposition pattern by M 2 DXL showed that X3D correctly predicts the 3-D dissolution process of exposed PMMA.[1474]

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“…A variety of three-dimensional (3-D) processing technologies, such as KOH anisotropic etching of silicon and laser machining [1], have been employed for the fabrication of microelectromechanical systems (MEMS). Previously, some research on 3-D processing methods using X-ray lithography with synchrotron radiation (SR) has been reported [2][3][4][5]. All these methods depend on the distribution of the exposure energy on the resist surface.…”

Section: Introductionmentioning

confidence: 99%

Shape Prediction of 3‐D Microstructures Fabricated by PCT Technique and Synchrotron Radiation Lithography

Horade

¹

,

Saito

²

2010

IEEJ Transactions Elec Engng

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We report in this paper simulations for deformed shape predictions of three-dimensional (3-D) microstructures fabricated by the plane pattern to cross-section transfer (PCT) technique and synchrotron radiation (SR) lithography. The investigation of the shape-prediction system enhances the possibility for higher accuracy of the prediction. In addition, the desired shapes can be confirmed by the shape prediction before designing the mask and running experiments. It is necessary to investigate a variety of error factors to shape prediction. We attempted various investigations. One of the possible causes could be the etching direction, which is dependent on the developing time. Therefore, we currently emphasize on the factor causing this error. In order to comprehend the mechanism of the factor, an algorithm that can simulate development was devised. We have developed a mathematical system of X-ray energy distribution onto the PMMA (polymethylmethacrylate) resist, and the shape prediction is consequent to the simulations based on calculations from the mathematics software. The mathematical system for energy distribution depends on the SR light source, X-ray mask specification, and resist specification. As a result, the predicted structures relevant to the absorbed energy-depth-position parameter set and absorbed energy-etching rate parameter set were obtained from this system. This system for shape prediction was implemented by the above parameter sets in C language.

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“…For example, in 2-D the three-node triangular element shown in Fig. 3(a) where the weights for , 1, 2 is called triangular coordinates in the FEM (4) We use the cyclic notation between ,…”

Section: Triangulated Fast Marching Update Scheme In X3d 1) Triangmentioning

confidence: 99%

3D simulation system for moving mask deep X-ray lithography

Hirai

¹

,

Matsuzuka

²

,

Hafizovic³

et al.

MHS2003. Proceedings of 2003 International Symposium on Micromechatronics and Human Science (IEEE Cat. No.03TH8717)

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0

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This paper presents a newly developed 3-Dimensional (3-D) simulation system for Moving Mask Deep X-ray Lithography (M 2 DXL) technique, and its validation. The simulation system named X-ray Lithography Simulation System for 3-Dimensional Fabrication (X3D) is tailored to simulate a fabrication process of 3-D microstructures by M 2 DXL. X3D consists of three modules: mask generation, exposure and resist development (hereafter development). The exposure module calculates a dose distribution in resist using an X-ray mask pattern and its movement trajectory. The dose is then converted to a resist dissolution rate. The development module adopted the "Fast Marching Method" technique to calculate the 3-D dissolution process and resultant 3-D microstructures. This technique takes into account resist dissolution direction that is required by 3-D X-ray lithography simulation. The comparison between simulation results and measurements of "stairs-like" dose deposition pattern by M 2 DXL showed that X3D correctly predicts the 3-D dissolution process of exposed PMMA.

show abstract

Fabrication of 3-dimensional microstructures using moving mask deep X-ray lithography (M/sup 2/DXL)

Cited by 16 publications

References 2 publications

Validation of X-Ray Lithography and Development Simulation System for Moving Mask Deep X-Ray Lithography

Validation of X-Ray Lithography and Development Simulation System for Moving Mask Deep X-Ray Lithography

Shape Prediction of 3‐D Microstructures Fabricated by PCT Technique and Synchrotron Radiation Lithography

3D simulation system for moving mask deep X-ray lithography

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