2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023
DOI: 10.1109/icept59018.2023.10492032
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Fabrication of 45-Degree Integrated Mirrors for Three-Dimensional Board-Level Optical Interconnects Realizing Efficient Light Coupling

Xiaofeng Liu,
Hua Miao,
Guodong Wang
et al.
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