Fabrication of a flexible polyimide-based electrostatically actuated MEMS relay

Liu, Junshan; Zhang, Shu; Wang, Chao; Han, Shan; Yin, Penghe; Zhang, Fengtian; Zhang, Yue; Xiong, Zhuang; Du, Liqun; Tang, Bin; Xu, Zheng

doi:10.1088/1361-6439/aacd2b

Cited by 5 publications

(3 citation statements)

References 28 publications

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“…After deep analysis of the Au metal contact layer, we figured out that the quality of the Au-electroplatting steps (2 and 13 in table II and III respectively) were quite poor. Comparing our results to published values in the literature, we have already obtained better performances compared to [12] with who has published 13 Ω and we could expect similar results to [8], [11] down to a few mΩ with better gold surface (lower roughness). We have proposed the design of an electrostatic MEMS relay working in harsh environment and presenting a low contact resistance fulfilling the requirement of electromagnetic motor.…”

Section: Contact Resistancesupporting

confidence: 89%

Design and manufacturing of an electrostatic MEMS relay for high power applications

Copt

Civet

Koechli

et al. 2021

Sensors and Actuators A: Physical

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This is a PDF file of an article that has undergone enhancements after acceptance, such as the addition of a cover page and metadata, and formatting for readability, but it is not yet the definitive version of record. This version will undergo additional copyediting, typesetting and review before it is published in its final form, but we are providing this version to give early visibility of the article. Please note that, during the production process, errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.

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Section: Contact Resistancesupporting

confidence: 89%

Design and manufacturing of an electrostatic MEMS relay for high power applications

Copt

Civet

Koechli

et al. 2021

Sensors and Actuators A: Physical

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“…At present, some progress has been made in the research of various functional flexible RF MEMS, mainly in flexible RF MEMS switches [ 46 , 47 , 48 , 49 , 50 , 51 , 52 , 53 , 54 , 55 , 56 , 57 , 58 , 59 , 60 , 61 , 62 , 63 , 64 , 65 , 66 , 67 , 68 , 69 , 70 , 71 , 72 , 73 , 74 , 75 ], phase shifters [ 76 , 77 , 78 ], reconfigurable antennas [ 78 , 79 , 80 , 81 , 82 , 83 , 84 , 85 , 86 ] and phased array antennas [ 87 , 88 , 89 , 90 ] based on them, in MEMS resonators [ 91 , 92 , 93 , 94 , …”

Section: Flexible Rf Mems With Different Functionsmentioning

confidence: 99%

Recent Advances in Flexible RF MEMS

Shi

Shen

2022

Micromachines

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Microelectromechanical systems (MEMS) that are based on flexible substrates are widely used in flexible, reconfigurable radio frequency (RF) systems, such as RF MEMS switches, phase shifters, reconfigurable antennas, phased array antennas and resonators, etc. When attempting to accommodate flexible deformation with the movable structures of MEMS, flexible RF MEMS are far more difficult to structurally design and fabricate than rigid MEMS devices or other types of flexible electronics. In this review, we survey flexible RF MEMS with different functions, their flexible film materials and their fabrication process technologies. In addition, a fabrication process for reconfigurable three-dimensional (3D) RF devices based on mechanically guided assembly is introduced. The review is very helpful to understand the overall advances in flexible RF MEMS, and serves the purpose of providing a reference source for innovative researchers working in this field.

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“…For example, the low modulus, high mechanical strength and high thermal stability have enabled the polyimide films to be used as sacrificial layers in suspended MEMS-based structures [4,5]. Another important application of polyimide-based layers is their use as active structural components in MEMS sensors and resonators [6][7][8]. In addition to their main func-tion as dielectric, alignment, passivation and insulator layers [9], polyimides have other useful applications such as a flexible substrate for different types of soft devices [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Delamination of polyimide in hydrofluoric acid

Al-mashaal

Cheung

2021

Acta Polytech

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Wet etching is a critical fabrication step for the mass production of micro and nanoelectronic devices. However, when an extremely corrosive acid such as hydrofluoric (HF) acid are used during etching, an undesirable damage might occur if the device includes a material that is not compatible with the acid. Polyimide thin films can serve as sacrificial/structural layers to fabricate freestanding or flexible devices. The importance of polyimide in microelectronics is due to its relatively low stress and compatibility with standard micromachining processes. In this work, a fast delamination process of a 4-μm-thin film of polyimide from a silicon substrate has been demonstrated. The films’ detachment has been performed using a wet-based etchant of HF acid. Specifically, the effect of HF concentration on the delamination time required to detach the polyimide film from the substrate has been investigated. This study is intended to provide the information on the compatibility of using polyimide films with HF, which can help in the design and fabrication of polyimide-based devices.

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Fabrication of a flexible polyimide-based electrostatically actuated MEMS relay

Cited by 5 publications

References 28 publications

Design and manufacturing of an electrostatic MEMS relay for high power applications

Design and manufacturing of an electrostatic MEMS relay for high power applications

Recent Advances in Flexible RF MEMS

Delamination of polyimide in hydrofluoric acid

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