2005
DOI: 10.1116/1.2062567
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Fabrication of a hard mask for InP based photonic crystals: Increasing the plasma-etch selectivity of poly(methyl methacrylate) versus SiO2 and SiNx

Abstract: We introduce cyclic reactive ion etching processes for SiO2 and SiNx hard masks where the fluorine-based etch steps are interleaved with N2 flushing steps in order to improve the selectivity to electron-beam resists. For SiO2 etching an etch-step duration of 30s resulted in a doubled selectivity of almost 4:1 between SiO2 and poly(methyl methacrylate) (PMMA) due to a reduced thermal load. We established the pattern transfer from a 200nm thick PMMA resist into a 600nm thick SiO2 layer for 200nm diameter holes. … Show more

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Cited by 28 publications
(12 citation statements)
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“…Details on the fabrication can be found elsewhere. 12,13 As indicated in the two-dimensional ͑2D͒ band-structure simulation 14 in Fig. 1͑b͒, the structure exhibits a TE band gap for u = a / = 0.27-0.43.…”
mentioning
confidence: 88%
“…Details on the fabrication can be found elsewhere. 12,13 As indicated in the two-dimensional ͑2D͒ band-structure simulation 14 in Fig. 1͑b͒, the structure exhibits a TE band gap for u = a / = 0.27-0.43.…”
mentioning
confidence: 88%
“…The combination of EBL and etching of such small dimensions is critical and was thoroughly optimized. Dry etching was carried out at room temperature in an Ar/CHF 3 atmosphere 18 . This results in a 1:2 etch ratio between the SiO 2 and PMMA EBL resist, which means that at resist with a thickness of at least 200 nm required for the process.…”
Section: Process Descriptionmentioning
confidence: 99%
“…The wafer was grown by metal-organic vapor phase epitaxy. The pattern was written by EBL into a poly(methyl methacrylate) resist [15] and transferred to a SiN x hardmask by dry etching [23]. The hardmask is used to etch the InP / InGaAsP / InP layer stack by inductively coupled plasma reactive ion etching with a Cl 2 /Ar/N 2 chemistry [20].…”
Section: Bend Fabrication and Characterizationmentioning
confidence: 99%