2013
DOI: 10.1007/s00542-013-1801-4
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Fabrication of a low temperature co-fired ceramic package using powder blasting technology

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Cited by 3 publications
(1 citation statement)
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“…(Grieshaber et al, ) A less common manufacturing method for such sensors uses Low Temperature Co‐fired Ceramics (LTCC) technology. (Lacrotte et al, ) LTCC are glass‐ceramic composite materials which have been used over the last 20 years in the production of electronic packages and multi‐chip modules for harsh environment applications found in the oil and gas and automotive sectors, for example. Recent material advances enabling self‐constrained LTCC layers have enabled the successful manufacturing of microsystems devices as an alternative to more traditional materials such as glass, polymers, and silicon as LTCC manufacturing does not require the use of expensive cleanrooms, photolithographic patterning, or corrosive chemicals.…”
Section: Electrochemical Impedance Spectroscopy and Electrochemical Smentioning
confidence: 99%
“…(Grieshaber et al, ) A less common manufacturing method for such sensors uses Low Temperature Co‐fired Ceramics (LTCC) technology. (Lacrotte et al, ) LTCC are glass‐ceramic composite materials which have been used over the last 20 years in the production of electronic packages and multi‐chip modules for harsh environment applications found in the oil and gas and automotive sectors, for example. Recent material advances enabling self‐constrained LTCC layers have enabled the successful manufacturing of microsystems devices as an alternative to more traditional materials such as glass, polymers, and silicon as LTCC manufacturing does not require the use of expensive cleanrooms, photolithographic patterning, or corrosive chemicals.…”
Section: Electrochemical Impedance Spectroscopy and Electrochemical Smentioning
confidence: 99%