Fabrication of a silicon-Pyrex-silicon stack by a.c. anodic bonding

Despont, M.; Gross, H. S.; Arrouy, F.; Stebler, C.; Staufer, U.

doi:10.1016/s0924-4247(97)80081-7

Cited by 30 publications

(14 citation statements)

References 7 publications

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“…The absence of bonding forces differentiates this method differs from others such as anodic bonding and silicon fusion bonding. During anodic bonding, for example, strong electrostatic attraction generates an applied bonding force [6,7], while a silicon fusion bond is initiated by an external pressure applied directly by the bonding chucks [8]. These induced stresses can be a problem for multilayer stacks.…”

Section: Fluidic Systemmentioning

confidence: 99%

Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems

et al. 2014

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Abstract:In this article, a novel Pyrex reflow bonding technology is introduced which bonds two functional units made of silicon via a Pyrex reflow bonding process. The practical application demonstrated here is a precision dosing system that uses a mechanically actuated membrane micropump which includes passive membranes for fluid metering. To enable proper functioning after full integration, a technique for device assembly must be established which does not introduce additional stress into the system, but fulfills all other requirements, like pressure tolerance and chemical stability. This is achieved with a stress-free thermal bonding principle to bond Pyrex to silicon in a five-layer stack: after alignment, the silicon-Pyrex-silicon stack is heated to 730 °C. Above the glass transition temperature of 525 °C Pyrex exhibits viscoelastic behavior. This allows the glass layer to come into close mechanical contact with the upper and lower silicon layers. The high temperature and the close contact promotes the formation of a stable and reliable Si-O-Si bond, without introducing mechanical stress into the system, and without deformation upon cooling due to thermal mismatch.

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Section: Fluidic Systemmentioning

confidence: 99%

Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems

et al. 2014

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“…19 The O 2-ions, however, remain localized and a strong electric field is formed in the narrow gap between the negatively charged pyrex surface and the grounded silicon (-nitride) sample. The electric field brings the surfaces into mechanical contact and O 2-ions can chemically react with the silicon in Si 3 N 4 .…”

Section: Pyramid Array Substrates Fabricationmentioning

confidence: 99%

Pyramid array substrates for biomedical studies

Löffler

Fleischer

Kern

et al. 2012

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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Cellular reactions to structured surfaces are the subject of intense studies in biomedical research, e.g., for implant technology. Substrates with well-defined structures in relevant materials such as titanium (Ti) are required for these investigations. The pyramidal arrays presented here offer very sharp edges and tips, which appeared to be the main adhesion spots in our earlier cell-surface-interaction studies. Using an etch process based on anisotropic etching of silicon in alkaline solution, the shape of the pyramids is strictly determined by the crystal structure of silicon, while the height as well as the pitch of the pyramids can be precisely controlled and, therefore, be varied in a systematic fashion. Being made from silicon nitride with a thin cover layer of titanium, they offer mechanical stiffness, inertness to all chemicals used in the cell experiments, and a high degree of biocompatibility.

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“…In general, glass-glass bonding is considered easier than silicon-silicon or polymer-polymer bonding because of the wide variety of methods available for glass (Chiem et al, 2000;Daridon et al, 2001;Jia, Fang, & Fang, 2004;Easley, Humphrey, & Landers, 2007;Tiggelaar et al, 2007). Silicon-glass anodic bonding is also a routine task (Despont et al, 1996;Berthold et al, 2000;Lee et al, 2000). He, Tait, and Regnier (1998).…”

Section: Glassmentioning

confidence: 99%

Microchip technology in mass spectrometry

Sikanen

Franssila

Kauppila

et al. 2009

Mass Spectrom. Rev.

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Microfabrication of analytical devices is currently of growing interest and many microfabricated instruments have also entered the field of mass spectrometry (MS). Various (atmospheric pressure) ion sources as well as mass analyzers have been developed exploiting microfabrication techniques. The most common approach thus far has been the miniaturization of the electrospray ion source and its integration with various separation and sampling units. Other ionization techniques, mainly atmospheric pressure chemical ionization and photoionization, have also been subject to miniaturization, though they have not attracted as much attention. Likewise, all common types of mass analyzers have been realized by microfabrication and, in most cases, successfully applied to MS analysis in conjunction with on-chip ionization. This review summarizes the latest achievements in the field of microfabricated ion sources and mass analyzers. Representative applications are reviewed focusing on the development of fully microfabricated systems where ion sources or analyzers are integrated with microfluidic separation devices or microfabricated pums and detectors, respectively. Also the main microfabrication methods, with their possibilities and constraints, are briefly discussed together with the most commonly used materials.

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Fabrication of a silicon-Pyrex-silicon stack by a.c. anodic bonding

Cited by 30 publications

References 7 publications

Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems

Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems

Pyramid array substrates for biomedical studies

Microchip technology in mass spectrometry

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