Fabrication of Au-Cu Alloy/Ti Layered Micro-Cantilevers and the Long-Term Structure Stability

Nitta, Kyotaro; Sone, Masato; Tang, Haochun; Chen, Chun-Yi; Chang, Tso-Fu Mark; Yamane, Daisuke; Iida, Shin‐ichi; Machida, Katsuyuki; Ito, Hiroyuki; Masu, Kazuya

doi:10.1109/sensors43011.2019.8956496

2019 Ieee Sensors 2019

DOI: 10.1109/sensors43011.2019.8956496

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Fabrication of Au-Cu Alloy/Ti Layered Micro-Cantilevers and the Long-Term Structure Stability

Kyotaro Nitta

Masato Sone

Haochun Tang

et al.

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2020

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“…6 A study on evaluating long-term structural stability of electroplated AuCu alloy microcantilevers reveals that the cantilevers stayed intact after 10 million cycles of vibration. 11,12 Young's modulus is another essential parameter for design of movable components in electronic devices, such as micro-springs having the length at hundreds of micrometer and the width at tens of micrometer in a MEMS inertial sensor. 1,13 Metallic materials are known to have the sample size effect.…”

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Alloy Electroplating and Young’s Modulus Characterization of AuCu Alloy Microcantilevers

Nitta

Chang

Tang

et al. 2020

J. Electrochem. Soc.

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This paper reports fabrication of AuCu alloy microcantilevers by alloy electroplating with a non-cyanide electrolyte and evaluation of the Young's modulus by a resonance frequency method. Length of the microcantilever is ranged from 50 ∼ 1000 μm, and the width is from 10 ∼ 20 μm. Effects of the applied current density (CD) on the composition, morphology, Vickers hardness, and Young's modulus of the AuCu alloy microcantilever are studied. The copper content increases from 0.8 ∼ 10.1 wt% when the CD increased from 0.01 ∼0.6 A dm −2 . The alloy electroplated at 0.6 A dm −2 shows the highest Vickers hardness at 379 HV. Young's moduli of the AuCu alloy microcantilevers are varied in a range from 70.4 ± 4.2 ∼ 80.0 ± 1.9 GPa when the copper content varied from 1.38 ∼ 4.03 wt%.

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Alloy Electroplating and Young’s Modulus Characterization of AuCu Alloy Microcantilevers

Nitta

Chang

Tang

et al. 2020

J. Electrochem. Soc.

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Fabrication of Au-Cu Alloy/Ti Layered Micro-Cantilevers and the Long-Term Structure Stability

Cited by 1 publication

References 7 publications

Alloy Electroplating and Young’s Modulus Characterization of AuCu Alloy Microcantilevers

Alloy Electroplating and Young’s Modulus Characterization of AuCu Alloy Microcantilevers

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