Fabrication of Bi2Sr2Ca1Cu2Ox superconductor using metallic substrate tape clad with Ag

Nemoto, Yuya; Fujii, Hiroki; Kitaguchi, Hitoshi; Kumakura, Hiroaki; Togano, K.; Shima, Kaori

doi:10.1016/s0921-4534(00)01568-9

Cited by 10 publications

(4 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Silver-coated nickel as a substrate for superconducting tapes has already been studied by different groups. Nemoto et al [8] and also Fujii et al [9] were successful with a 10 µm thick Ag buffer layer on pure nickel. Nevertheless, this silver thickness of 10 µm is at least two times too thick to really lower the production cost.…”

Section: Substrate Requirementsmentioning

confidence: 98%

Investigation of Ag buffered Ni and Ni Cr alloys as substrates for the preparation of bismuth superconducting tapes

Régnier¹,

Bifulco-Michon²,

Poissonnet³

et al. 2002

Supercond. Sci. Technol.

View full text Add to dashboard Cite

We review and comment on the various requirements that a metallic substrate has to meet to be a good candidate for the fabrication of electrodeposited BSCCO superconducting tapes. We conclude that, in the present state of the art, no metallic substrate is really ideal. Hence we have investigated in detail the use of silver-buffered nickel-based alloys that seem to be a viable alternative to pure silver tape, which is more expensive and less resistant to high temperature. The major difficulty encountered was the occurrence of holes and blisters induced in the silver layers by the oxidation of the nickel underlayer during the heat treatments performed at high temperature in open air, which according to our procedure are required to synthesize high-temperature superconducting tapes. It was found that the liquid phases, transiently present in the process during the synthesis of the precursor phases, infiltrate between the Ag layer and the substrate through these holes and strongly react with the substrate transferring the poisoned element to the superconducting film greatly reducing its superconducting properties. Hence, several routes have been explored to try and suppress hole formation. It was found that pre-oxidizing the substrate at 880 °C for 1 h in open air sufficiently lowers the hole and blister densities to allow us to synthesize good Bi-2212 tapes on pure nickel, but not on Ni80–Cr20 alloys. A much more interesting solution seems to be to pre-anneal the substrate in a hydrogenous atmosphere which permits us to remove blisters and holes.

show abstract

Section: Substrate Requirementsmentioning

confidence: 98%

Investigation of Ag buffered Ni and Ni Cr alloys as substrates for the preparation of bismuth superconducting tapes

Régnier¹,

Bifulco-Michon²,

Poissonnet³

et al. 2002

Supercond. Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…No intermediate annealing was necessary. Without this binding Cu foil the Ag/Ni composite ribbons could only be deformed with several intermediate annealings [31]. For further reinforcement and to overcome the magnetic properties of pure Ni, different alloys such as NiCu, NiV or NiCrV were also tested.…”

Section: Ag/ni Ag/ni-alloys Composite Ribbonsmentioning

confidence: 99%

Reinforced {110} textured Ag/Ni composite ribbons for biaxially oriented YBCO coated tapes

Suo

Genoud

Schindl

et al. 2001

Supercond. Sci. Technol.

View full text Add to dashboard Cite

New, mechanically reinforced, {110} textured Ag composite ribbons were fabricated as possible inexpensive substrates for coated conductors without any buffer layer. The key part of this work was the use of a thin but textured Ag outlayer on an AgMg, Ni, or Ni alloys core that ensures the mechanical reinforcement while decreasing the amount of Ag. A thin Cu (50 µm) foil was intercalated between rectangular Ag and AgMg, Ni, or Ni alloys pieces to obtain a tough bond. After sintering, the ingots sustained a cold plastic deformation up to thicknesses of 300, 100 and 50 µm without any intermediate annealing. The prepared composite ribbons were then recrystallized to obtain the {110} texture in the top Ag layer. For the Ag/AgMg ribbons, a further annealing in flowing oxygen was performed to reinforce the ribbons by an internal oxidation process in the AgMg layer without changing the {110} 011 texture in the Ag outerlayer. A unique and stable {110} 011 texture was obtained in Ag/Ni composite ribbons after annealing at 800 • C. The highest degree of texture was observed in 300 µm thick Ag/Ni ribbon, x-ray orientation distribution function and electro backscattered diffraction (EBSD) analysis of the top Ag layer in this ribbon revealed a sharp {110} 011 texture with an in-plane misorientation angle of 10-15 • . Meanwhile, a promising {110} 011 texture was also found in 50 µm thick ribbons with 25 • in-plane misorientation angle. In the last case, a substrate with no more than 16 µm of the textured Ag layer was produced by this new technique, which decreased the total amount of Ag by 40% compared with pure Ag ribbons of the same thickness.

show abstract

“…However, it is reported that in composite Ag-Ni ribbons, which are used as substrates for Bi-2212 tapes, Ag can prevent the diffusion of Ni toward the Bi-2212 layer [15,16]. Thereafter, Ag-Ni composite-sheathed Bi-2223 tapes using Ni as the outer sheath were successfully manufactured by Grivel et al [17] and Li et al [18].…”

Section: Introductionmentioning

confidence: 99%

Fabrication and Properties of Ag–Ni Bimetallic Sheathed (Bi,Pb)-2223 Tapes

Chen

Liu

et al. 2012

J Supercond Nov Magn

View full text Add to dashboard Cite

10-meter-long Ag-Ni bimetallic sheathed (Bi,Pb)-2223 tapes with outer nickel sheath and inner silver sheath have been successfully fabricated by the "Powder in tube" technique. Microstructure and phase evolution studies by means of SEM and XRD, as well as critical current density (J c ) measurements have been performed. It is found that the nickel sheath and dwell time in the first sintering process have great influences on the texture evolution, phase transformation and J c of the Bi-2223/Ag/Ni tapes. Monofilament (Bi,Pb)-2223 tape with a J c of 6656 A cm −2 and 61-filament tape with a J c of 12420 A cm −2 are obtained. Although using composite bimetallic sheaths can reduce production costs and improve mechanical properties of the Bi-2223 tapes, the Bi-2223 content and J c of Bi-2223/Ag/Ni tapes are relatively lower than that of traditional Bi-2223/Ag tapes. Meanwhile, due to higher Bi-2223 content and better alignment of Bi-2223 grains, tapes with 61-filament have higher J c than mono-filament tapes.

show abstract

Fabrication of Bi2Sr2Ca1Cu2Ox superconductor using metallic substrate tape clad with Ag

Cited by 10 publications

References 8 publications

Investigation of Ag buffered Ni and Ni Cr alloys as substrates for the preparation of bismuth superconducting tapes

Investigation of Ag buffered Ni and Ni Cr alloys as substrates for the preparation of bismuth superconducting tapes

Reinforced {110} textured Ag/Ni composite ribbons for biaxially oriented YBCO coated tapes

Fabrication and Properties of Ag–Ni Bimetallic Sheathed (Bi,Pb)-2223 Tapes

Contact Info

Product

Resources

About