2007 Digest of Papers Microprocesses and Nanotechnology 2007
DOI: 10.1109/imnc.2007.4456268
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Fabrication of Bistable Prestressed Curved-Beam

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Cited by 5 publications
(5 citation statements)
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“…2. 8) After cleaning, Si substrate was thermally oxidized to grow SiO 2 layer as the base material to form the curved beam. Following the photoresist coating and the beam patterning, the unnecessary SiO 2 was removed by wet etching.…”
Section: Fabricationmentioning
confidence: 99%
See 1 more Smart Citation
“…2. 8) After cleaning, Si substrate was thermally oxidized to grow SiO 2 layer as the base material to form the curved beam. Following the photoresist coating and the beam patterning, the unnecessary SiO 2 was removed by wet etching.…”
Section: Fabricationmentioning
confidence: 99%
“…From the previous studies, it was known that the snap action in the bistable curved beam involves a conversion of the actuation energy to the bending and compression energies of the beam. [1][2][3][4][5][6][7][8] By suppressing the bending energy development, more portions of the actuation energy can be converted to the compression energy and the snap action is enabled to occur at lower actuation force. This can be realized by distributing the actuation force higher around the center and lower toward both ends of the curved beam in a symmetrical manner.…”
Section: Introductionmentioning
confidence: 99%
“…Figure 6 shows the fabrication process of the prestressed curved beam. 6) The beam is vertical snap type and created by patterning the active Si layer of silicon-on-isolator (SOI). In this study, an SOI wafer having 200 nm thick active Si layer and 400 nm thick buried oxide (BOX) was used.…”
Section: Fabricationmentioning
confidence: 99%
“…1. 6) If F is large enough in such axial compressive force P reaches a certain critical value, the beam begins to snap from initial stable bending state to the opposite one. If F vs d curve is integrated, potential energy Ep vs d curve with two valleys is obtained, which corresponds to the beam's bistability.…”
Section: Introductionmentioning
confidence: 99%
“…Different from pre-compressed beam, a pre-stressed beam is curved by artificially creating stress during the fabrication process. In [8][9][10], Pane and Asano fabricated a bistable micro-actuator by patterning the active silicon (Si) layer of SOI (silicon-on-isolator). The pre-stress was introduced by the difference in thermal expansion between Si and SiO 2 layers during the oxidation process.…”
Section: Introductionmentioning
confidence: 99%