2016 IEEE International Ultrasonics Symposium (IUS) 2016
DOI: 10.1109/ultsym.2016.7728763
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Fabrication of capacitive micromachined ultrasonic transducers using a boron etch-stop method

Abstract: Abstract-Capacitive Micromachined Ultrasonic Transducers (CMUTs) fabricated using Silicon-On-Insulator (SOI) wafers often have large thickness variation of the flexible plate, which causes variation in both pull-in voltage and resonant frequency across the CMUT array. This work presents a bond and boron etch-stop scheme for fabricating the flexible plate of a CMUT. The proposed fabrication method enables precise control of the plate thickness variation and is a low cost alternative to the SOI-based process. N-… Show more

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“…Up to now, the uniformity of the CMUT array performance has always been evaluated in terms of standard deviation of the biased transducer resonance frequency [26]- [29], and occasionally in terms of acoustic performance variability (e.g., sensitivity bandwidth and center frequency standard deviation) [12], [30]- [32]. Nevertheless, a quantitative evaluation of the effect of the fabrication-related variability of the geometrical parameters on the transducer performance variation has never been performed.…”
Section: Introductionmentioning
confidence: 99%
“…Up to now, the uniformity of the CMUT array performance has always been evaluated in terms of standard deviation of the biased transducer resonance frequency [26]- [29], and occasionally in terms of acoustic performance variability (e.g., sensitivity bandwidth and center frequency standard deviation) [12], [30]- [32]. Nevertheless, a quantitative evaluation of the effect of the fabrication-related variability of the geometrical parameters on the transducer performance variation has never been performed.…”
Section: Introductionmentioning
confidence: 99%