Fabrication of Cobalt-Based Nano-Composite Film for Corrosion Mitigation of Copper in Flow Chloride Medium

Abstract

Corrosion of metals leads to high maintenance costs, as well as potential threats to structural health and safety. Here, we demonstrate the coating of cobalt tungstate (CoWO4) nanoparticles (NPS)/5-mercapto-1-phenyl-1 H-tetrazole derivative (MPT) used as a nano-composite film on Cu surface for the blocking of micropores to hinder the propagation of metastable pits in an aggressive NaCl medium. The mechanism of interaction between the nanoparticles and tetrazole derivative, in addition to the mode of anchoring to the metal surface and blocking the penetration of chloride ions (Cl−), are all investigated. In this investigation, CoWO4 is synthesized via a wet chemical route and thereafter, is combined with MPT at an optimized ratio thus formulating a nano-composite corrosion inhibitor which in solution gets coated on Cu surface. Atomic force and scanning electron microscopic images of the bare Cu reveal dip pits, which by the coating of the nano-composite are suppressed at the nucleation stage during exposure to the aggressive 3.5% NaCl electrolyte under flow conditions. Electrochemical analysis shows high protection of Cu up to 97% efficiency in the presence of the newly formulated nano-composite inhibitor film.

Synthesis, Characterization, and Evaluation of Co-MOF Based ZIF-67 for CO2 Corrosion Inhibition of X65 Steel: Insights from Electrochemical Studies and a Machine Learning Algorithm

“…Figure b evidenced the core level spectrum of Co 2p at binding energies of 798.5 and 782.3 eV with the spin–orbital coupling deconvoluted to Co 2p 1/2 and Co 2p 3/2 respectively. The satellite peaks of Co 2p 1/2 and Co 2p 3/2 were also observed confirming the presence of Co . The Fe, FeOOH, FeCO 3 , and Fe 2 O 3 peaks in Figure c (Fe 2p 3/2 spectrum) are connected to the iron oxide family in the range of 714.3, 719.5, 723.1, and 728.6 eV, respectively.…”

“…Hence, this evidenced the presence of a hybrid protective film which impedes the penetration of the corrosive ions reaching the Fe surface. were also observed confirming the presence of Co. 44 The Fe, FeOOH, FeCO 3 , and 2 O 3 peaks in Figure 8c (Fe 2p 3/2 spectrum) are connected to the iron oxide family in the range of 714.3, 719.5, 723.1, and 728.6 eV, respectively. In Figure 8d, the observed peaks for O 1s spectrum 530.9, 532. , due to solution chemical reaction with the steel surface prior to full film formation.…”

Nitrogen–Sulfur Codoped Ti3C2Tx MXene as a Corrosion Inhibitor for Copper in a Chloride Environment: Electrochemical and Computational Studies

“…The observed phenomenon is the pure corrosion behavior of Cu due to the corrosion product formation. A three-stage-wise process (active, passive, and transpassive region) results from the presence of a soluble cuprous chloride complex. , Table shows the key parameters calculated via an extrapolation route. Regardless of the three-stage-wise process, a Tafel region needs a length of at least one decade of current which in this case is possible by the extrapolation of both the anodic and cathodic portions starting from at least 50–100 mV away from ( E corr ), with the extrapolated regions of more than one decade of current. , Table clearly shows that the addition of N,S codoped Ti 3 C 2 T x MXene decreases the current densities ( i corr ) compared to the blank solution.…”

“…Metal exposure to different aggressive environments has a consequence of corrosion attacks which leads to huge economic losses and threats to life in work places and has always been a difficult global challenge. − Metallic materials are highly useful in structural and industrial applications. For instance, Cu finds extensive use in various industries due to high electrical and thermal conductivities, malleability, mechanical workability, and so forth. , However, Cu can be heavily degraded in salty water due to the aggressive attack of chloride ions. , At lower concentrations of chloride ions, anodic dissolution of Cu occurs, leading to cuprous chloride complex (CuCl 2 ) formation which easily melts to expose the Cu surface to degrade . At higher concentrations, formation of other cuprous chloride complexes such as CuCl 3 – and CuCl 4 – is possible, leading to numerous pits on the Cu surface as evidence of integrity loss .…”

“…5,6 However, Cu can be heavily degraded in salty water due to the aggressive attack of chloride ions. 7,8 At lower concentrations of chloride ions, anodic dissolution of Cu occurs, leading to cuprous chloride complex (CuCl 2 ) formation which easily melts to expose the Cu surface to degrade. 7 At higher concentrations, formation of other cuprous chloride complexes such as CuCl 3 − and CuCl 4 − is possible, leading to numerous pits on the Cu surface as evidence of integrity loss.…”