Fabrication of CuW pseudo alloy by W–CuO nanopowders

Liang, Shuhua; Wang, Xianhui; Wang, Lingling; Weichan, Cao; Fang, Zhikang

doi:10.1016/j.jallcom.2011.12.018

Cited by 29 publications

(6 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…XRD patterns of the sintered samples are shown in Figure 2. It was observed that the position and intensity of the diffraction peaks matched the reference plots [29], indicating the presence of only W and Cu phases. No oxide phase was found in the XRD patterns, implying the success of sintering in vacuum conditions.…”

Section: X-ray Diffraction (Xrd)mentioning

confidence: 67%

Effect of Nano Copper on the Densification of Spark Plasma Sintered W–Cu Composites

et al. 2021

View full text Add to dashboard Cite

In the present work, nano Cu (0, 5, 10, 15, 20, 25 wt.%) was added to W, and W–Cu composites were fabricated using the spark plasma sintering (S.P.S.) technique. The densification, microstructural evolution, tensile strength, micro-hardness, and electrical conductivity of the W–Cu composite samples were evaluated. It was observed that increasing the copper content resulted in increasing the relative sintered density, with the highest being 82.26% in the W75% + Cu25% composite. The XRD phase analysis indicated that there was no evidence of intermetallic phases. The highest ultimate (tensile) strength, micro-hardness, and electrical conductivity obtained was 415 MPa, 341.44 HV0.1, and 28.2% IACS, respectively, for a sample containing 25 wt.% nano-copper. Fractography of the tensile tested samples revealed a mixed-mode of fracture. As anticipated, increasing the nano-copper content in the samples resulted in increased electrical conductivity.

show abstract

Section: X-ray Diffraction (Xrd)mentioning

confidence: 67%

Effect of Nano Copper on the Densification of Spark Plasma Sintered W–Cu Composites

et al. 2021

View full text Add to dashboard Cite

show abstract

“…Wet-chemical processes, such as spray-drying, sol-gel, and co-precipitation, were proposed to overcome the contamination problem [29][30][31][32] . In the wet-chemical processes, soluble W and Cu salts were used as raw materials to synthesize precursors, which were then converted to a W-Cu composite powder by calcination and thermal hydrogen reduction.…”

Section: Nanoscale W-cu Composite Powdermentioning

confidence: 99%

W–Cu composites with submicron- and nanostructures: progress and challenges

et al. 2019

View full text Add to dashboard Cite

W-Cu composite materials are widely used in civilian industries and aerospace fields owing to their integrated properties of high hardness, wear and arc resistance, electrical and thermal conductivities, and low coefficient of thermal expansion. The recently developed submicron-and nanostructured W-Cu composites exhibit superior performance compared to their conventional coarse-grained counterparts and are expected to further expand applications of this group of materials. This review is focused on recent important progress in the preparation, characterization, and mechanical and physical properties of W-Cu composites with refined structures. We summarize the technologies that are capable of refining component structures and evaluate their advantages and limitations. Furthermore, the effects of component refinement and additives such as alloying elements and dispersed particles on the comprehensive performance of W-Cu composites are demonstrated. At the end of the review, we propose potential research issues and directions worthy of attention for the future development of W-Cu composites.

show abstract

“…It shows that, at a specific sintering temperature, the relative density of sintered composites can be enhanced gradually and reach nearly full compactness by reducing the W particle size less than 200 nm. Furthermore, the prepared composite bulk exhibits a fine and homogeneous microstructure with a highly connective skeleton of W and Cu, and excellent performance in terms of arc resistance, thermal expansion, hardness and strength [13][14][15][16].…”

Section: Introductionmentioning

confidence: 99%

High hardness and wear resistance of W-Cu composites achieved by elemental dissolution and interpenetrating nanostructure

Hou

Cao

et al. 2020

Nanotechnology

View full text Add to dashboard Cite

The effects of aluminum (Al) on the microstructure, hardness and wear resistance of tungsten-copper (W-Cu) composites were investigated. The W-Cu composites were fabricated via mechanical alloying and spark plasma sintering. It is found that the Al dissolved in the metastable W-Cu alloy can act as an ‘intermediary’ to hinder the diffusion and phase separation process of Cu out of W during sintering, constructing an interpenetrating nanostructure where Al redistributes in W and Cu. Correspondingly, the hardness of composites increase from 463.4 HV30 to 512.05 HV30 due to Al dissolution and formation of the nanostructure, and their contributions to hardness variation of the original W and Cu regions were distinguished by nanoindentation. In addition, the wear volume was also reduced to less than a third of that of original W-Cu composites without Al addition due to the abundant interfaces and mechanical strengthening, which restricts the removal of W and propagation of cracks during the wear process.

show abstract

Fabrication of CuW pseudo alloy by W–CuO nanopowders

Cited by 29 publications

References 23 publications

Effect of Nano Copper on the Densification of Spark Plasma Sintered W–Cu Composites

Effect of Nano Copper on the Densification of Spark Plasma Sintered W–Cu Composites

W–Cu composites with submicron- and nanostructures: progress and challenges

High hardness and wear resistance of W-Cu composites achieved by elemental dissolution and interpenetrating nanostructure

Contact Info

Product

Resources

About