“…The diffraction peaks were seen at 2θ of 32.5°, 35.5°, 38.7°, 48.6°, 53.4°, 61.4°, 65.7°, 67.8°, 68.7°, 72.8°, and 75.1° corresponded to (110), (−111), (111), (−202), (020), (−113), (202), (113), (−311), (221), and (−222) planes of CuO sample, respectively (Figure A(a) and Figure S6b). Moreover, the polyhedron morphology of CuO is distinguished by the presence of (111) lattice planes on its terminal surfaces . The ideal temperature range for annealing materials is critical to avoid grain coarsening or phase shifts, as higher temperatures increase crystallinity, reduce defects, larger grain size, and improve the XRD diffraction peaks of CuO material. , The intensity of diffraction peaks may increase with higher annealing temperatures, indicating that the size of CuO crystallites might enhance sintering and lead to a larger grain size.…”