Fabrication of Flexible Fine Through-hole Electrodes for Printed Devices using UV-NIL

Abstract

Demand for printed electronic devices is increasing, likewise the attention being paid to through-hole electrodes as an integration approach. In comparison with wire bonding integration methods, through-hole electrodes occupy smaller surface areas and have lower power consumption rates. Generally, the diameters of through-holes fabricated in flexible substrates are larger than those developed in rigid substrates. In this study, ultraviolet nanoimprint lithography was used to fabricate microscale through-holes in a flexible substrate, and these holes were subsequently filled with silver ink to form through-hole electrodes.