2023
DOI: 10.1007/s00542-023-05491-0
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Fabrication of high-aspect-ratio stepped Cu microcolumn array using UV-LIGA technology

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Cited by 3 publications
(2 citation statements)
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“…In most industrial practices, the current densities applied to the LIGA electroforming process are below 2 A/dm 2 . To overcome these limitations, some lower-cost modified LIGA-like techniques such as UV-LIGA [ 22 , 23 ], Laser-LIGA [ 24 ], and ICP-RIE LIGA [ 25 ] have been developed by using conventional light sources or other methods, and photoresists to fabricate the masks. However, compared to LIGA technology, LIGA-like techniques cannot directly achieve HAR-MMMCs in a single step because the ARs of the through-masks they use are much lower.…”
Section: Introductionmentioning
confidence: 99%
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“…In most industrial practices, the current densities applied to the LIGA electroforming process are below 2 A/dm 2 . To overcome these limitations, some lower-cost modified LIGA-like techniques such as UV-LIGA [ 22 , 23 ], Laser-LIGA [ 24 ], and ICP-RIE LIGA [ 25 ] have been developed by using conventional light sources or other methods, and photoresists to fabricate the masks. However, compared to LIGA technology, LIGA-like techniques cannot directly achieve HAR-MMMCs in a single step because the ARs of the through-masks they use are much lower.…”
Section: Introductionmentioning
confidence: 99%
“…However, compared to LIGA technology, LIGA-like techniques cannot directly achieve HAR-MMMCs in a single step because the ARs of the through-masks they use are much lower. Although some researchers made some attempts to achieve HAR-MMMCs using multiple electroforming steps with a series of low-thickness through-masks, the electroforms fabricated have greatly reduced geometrical accuracy due to the unavoidable misalignment of the operations [ 22 ].…”
Section: Introductionmentioning
confidence: 99%