Fabrication of Line & Space Structure and Wiring on 3D Surface Features with Imprinting Process

Abstract

In this study, we have investigated the wiring on the curved surfaces with nanoimprint technology using the flexible resin mold. The maximum transfer ratios of line & space structures of polyetherimide (PEI) and cyclic olefin copolymer (COC) were higher than 93% by using thermal nanoimprint process. It found that the silver nano-ink can be transferred to the curved surfaces using the UV curable resin as the adhesive material. The wired on curved surfaces using a flexible polymer mold, silver nano-ink, and UV curable resin as an adhesive showed the electrical conduction indicated. Therefore, the possibility to apply nanoimprint technology to wiring on three-dimensional surface features was indicated.